Novel QFN chip packaging process

Abstract

The invention discloses a novel QFN chip packaging process. The process comprises the steps of pressing a chip frame structure, gluing a chip seat, curing a chip, and cutting and curing a plastic packaging plate. The invention belongs to the technical field of integrated circuit packaging. According to the novel QFN chip packaging process, a cutting mechanism is arranged on one side of a rack; a plastic packaging plate is arranged into a groove inside a movable frame; a cutting air cylinder driving shaft pushes the bottom end of a cutting knife rest to apply pressure to the plastic packaging plate till the bottom end of the cutting knife rest enters a cutting groove, the cutting knife rest is used for applying pressure to the plastic packaging plate, so that the plastic packaging plate is attached to the top face of the chip; since the plastic packaging plate is cut in a static pressure cutting mode, the situation that a metal frame is cut in the process that a cutting knife is used for cutting and separating a device can be avoided, smoothness of the edge of a product pin is guaranteed, meanwhile, the service life of a blade can be effectively prolonged; and a discharging frame is driven to move horizontally on a base through a horizontal moving track, so that the packaging working procedures can be reduced, and the packaging efficiency of the chip is effectively improved.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a novel QFN chip packaging process. Background technique [0002] QFN is a leadless package with a square or rectangular shape. There is a large-area exposed pad at the center of the bottom of the package for heat conduction, and there are conductive pads around the periphery of the package around the large pad for electrical connection; [0003] At present, when packaging QFN chips, it is necessary to use a dicing knife to cut the separated devices. During the cutting process, the dicing knife will cut the metal while cutting the plastic compound, causing the edges of the product pins to curl, reducing the life of the blade and affecting product quality. ; [0004] In order to solve the above problems, the present invention proposes a novel QFN chip packaging process. Contents of the invention [0005] (1) Solved technical problems [0006] In order to ...

AI Technical Summary

Problems solved by technology

[0003] At present, when packaging QFN chips, it is necessary to use a dicing knife to cut the separated devices. During the cutting process, the dicing knife will cut the metal while cutting the plastic compound, causing the edges of the product pins to curl, reducing the life of the blade and affecting product quality. ;

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