Packaging mechanism and packaging method for semiconductor substrate

Abstract

The invention provides a packaging mechanism and a packaging method for a semiconductor substrate, belongs to the technical field of semiconductor substrate packaging structures, and aims to solve the problems that in the packaging process of the semiconductor substrate in the prior art, the packaging structure cannot be adjusted with internal semiconductor components, chips and substrates, a sealing assembly which is tightly connected with a semiconductor substrate deforms and loosens along with the prolonging of the service time, the interior of a packaging structure is lack of a tightness adjusting structure, and the tightly packaged semiconductor substrate loosens along with the prolonging of the service time. The packaging mechanism comprises a packaging seat; a semiconductor electrical substrate is fixedly connected to the middle of the interior of the packaging seat, and the packaging seat comprises a side wall positioning frame; the two ends of a buffer pressing layer are connected to the two side walls of the packaging base through gluing. A substrate and a base can be prevented from being loose in connection during long-term use, simple reinforcement can be performed, and the connection tightness between the semiconductor substrate and the base can be maintained.

Description

technical field [0001] The invention belongs to the technical field of semiconductor substrate packaging structures, and more specifically relates to a packaging mechanism and packaging method for semiconductor substrates. Background technique [0002] The package substrate is an important part of the electronic package, and it is the bridge between the chip and the external circuit. In the package, the substrate plays the role of realizing the transmission of current and signal between the chip and the outside world, mechanically protecting and supporting the chip, dissipating heat from the chip to the outside world, and transitioning the space between the chip and the external circuit. The substrate material is used to manufacture semiconductor components. And the basic material of printed circuit board. [0003] For example, the application number: CN201610132896.8 The present invention discloses an electronic package and its semiconductor substrate and manufacturing met...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above-mentioned technical problems, the present invention provides a packaging mechanism and packaging method for semiconductor substrates to solve the gap between the packaging structure and the internal semiconductor components, chips, and substrates during the packaging process of the semiconductor substrate in the prior art. It cannot be adjusted, and the sealing components tightly connected to the semiconductor substrate will deform and loosen as the usage time increases. There is no tightness adjustment structure inside the packaging structure, and the semiconductor substrate that is tightly packaged will become loose with the extension of usage time.

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