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Medium isolation type pressure sensor and manufacturing method thereof

A pressure sensor and medium isolation technology, applied in the direction of measuring fluid pressure, instruments, measuring devices, etc., can solve the problems of inability to miniaturize, expensive, difficult mass packaging and calibration testing, etc., to achieve reliability, improve performance, The effect of balancing measurement accuracy and support force

Pending Publication Date: 2021-10-08
昆山灵科传感技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, the current media-isolated pressure sensors are difficult to automate mass packaging and calibration testing, are expensive, cannot be miniaturized, and cannot meet user needs

Method used

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  • Medium isolation type pressure sensor and manufacturing method thereof
  • Medium isolation type pressure sensor and manufacturing method thereof
  • Medium isolation type pressure sensor and manufacturing method thereof

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Embodiment Construction

[0024] The specific implementation of the medium-isolated pressure sensor and its manufacturing method provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0025] figure 1 is a schematic structural diagram of the medium-isolated pressure sensor provided by the first embodiment of the present invention, please refer to figure 1 , The medium-isolated pressure sensor of the present invention includes a substrate 10, a housing 20, at least one pressure sensor chip 30 and a medium liquid.

[0026] The substrate 10 includes but not limited to a ceramic circuit board or a printed circuit board. Electrical connection lines are provided in the substrate 10 to electrically connect the pressure sensor chip 30 with the outside. For example, in this embodiment, the substrate 10 is a ceramic circuit board, and an electrical connection circuit (not shown in the drawings) is disposed therein to electrically connect the pressure s...

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Abstract

The invention provides a medium isolation type pressure sensor and a manufacturing method thereof. The medium isolation type pressure sensor comprises a substrate, a shell, at least one pressure sensor chip and a medium liquid; the shell comprises side walls and a top cover, the side walls are connected with the top cover in a sealed mode, the side walls are made of hard materials, the top cover is made of flexible materials, and the shell is buckled on the substrate to form an accommodating cavity; the at least one pressure sensor chip is fixed on the substrate and is arranged in the accommodating cavity; and the accommodating cavity is filled with the medium liquid, and external pressure can be conducted to the pressure sensor chip through the shell and the medium liquid. The medium isolation type pressure sensor has the advantages that the shell comprises the side wall made of the hard material and the top cover made of the flexible material, the measurement precision and the supporting force can be balanced, the reliability is considered, the output of the medium isolation type pressure sensor is also ensured, the defects caused by a single shell material can be avoided, and the performance of the medium isolation type pressure sensor is greatly improved.

Description

technical field [0001] The invention relates to the field of sensor packaging, in particular to a medium-isolated pressure sensor and a manufacturing method thereof. Background technique [0002] According to different working principles, pressure sensors can be mainly divided into piezoresistive, capacitive, resonant, piezoelectric, optical fiber and other pressure sensors; among them, MEMS piezoresistive pressure sensors based on micro-electromechanical systems are small in size, Many advantages such as light weight, high sensitivity, stability and reliability, low cost, simple manufacturing process and easy integration have become the mainstream technology of pressure sensor chips. [0003] The usual packaging form of MEMS piezoresistive pressure sensors is to seal the pressure-sensitive chip on the metal or plastic casing by direct bonding or glass transition bonding, and then realize the electrical connection through gold or aluminum wires. Its pressure sensitive unit ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L19/14G01L19/06
CPCG01L19/143G01L19/06
Inventor 张兵兵
Owner 昆山灵科传感技术有限公司
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