High-cleanliness semiconductor wafer automatic loading equipment

Abstract

The invention relates to the technical field of semiconductors, and discloses high-cleanliness semiconductor wafer automatic loading equipment which comprises an electromechanical box, a main box body arranged on one side of the electromechanical box and an auxiliary box body arranged on the other side of the electromechanical box. A taking mechanism is arranged at the upper end of the electromechanical box, and a sealing mechanism and a conveying mechanism are arranged on one side of the main box body. One end of the conveying mechanism is connected with the inner wall of the main box body, a lifting mechanism is arranged in the main box body, a lifting mechanism is arranged in the auxiliary box body, clamping plates are placed on the two sides of the loading box set through extension of a main telescopic rod, then the loading box set is lifted upwards through a lifting rod, and when the loading box set moves to an elastic opening, the same magnetism is attached to the electromagnetic disc so that a repulsive force can be generated, the two sets of clamping plates are separated, the loading box set can move upwards and penetrate through the elastic opening, the elastic opening can only penetrate through the clamping plate from bottom to top, loading preparation of the loading box set is achieved, the automation degree is high, and labor is saved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an automatic loading device for high-cleanness semiconductor wafers. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical monocrystalline silicon. After grinding, polishing, and slicing, silicon wafers are formed, that is, wafers. At present, domestic wafer production lines are mainly 8-inch and 12-inch. [0003] After the wafer is produced, it needs to be loaded. The current loading equipment has a low degree of automation and more manual operations during the working process, which leads to more contact between the wafer and the outside world, which affects the overall quality of the wafer. Secondly, in the production process, some wafers have defects and are diffic...

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Problems solved by technology

[0005] The object of the present invention is to provide a high-cleanliness semiconductor wafer automatic loading equipment, which solves the problem that the current loading equipment in the background technology has a low degree of automation and a lot of manual operations during the working process, which leads to the relatively low contact between the wafer and the outside world. There are many, thus affecting the overall quality of the wafer. Secondly, in the production process, some wafers have defects and are difficult to be found, resulting in damaged wafers being packaged and used, which affects the quality of later use.

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