Unlock instant, AI-driven research and patent intelligence for your innovation.

EXPOSURE METHOD, EXPOSURE APPARATUS, AND MANUFACTURING METHOD of SEMICONDUCTOR DEVICE

An exposure method and exposure device technology, which are applied in semiconductor/solid-state device manufacturing, photolithographic process exposure device, semiconductor/solid-state device testing/measurement, etc.

Active Publication Date: 2021-10-12
KIOXIA CORP
View PDF19 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are cases where not only the alignment mark position is detected, but also the detection result is corrected to perform alignment.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • EXPOSURE METHOD, EXPOSURE APPARATUS, AND MANUFACTURING METHOD of SEMICONDUCTOR DEVICE
  • EXPOSURE METHOD, EXPOSURE APPARATUS, AND MANUFACTURING METHOD of SEMICONDUCTOR DEVICE
  • EXPOSURE METHOD, EXPOSURE APPARATUS, AND MANUFACTURING METHOD of SEMICONDUCTOR DEVICE

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] Hereinafter, non-limiting illustrative embodiments will be described with reference to the drawings. In all the drawings, the same or corresponding components or parts are assigned the same or corresponding reference signs, and repeated descriptions are omitted. In addition, the drawings are not intended to show components or a relative size comparison between parts, therefore, the specific size can be determined by the industry according to the following non-limiting embodiments.

[0017] First, refer to figure 1 The exposure apparatus according to the embodiment will be described. figure 1 It is a block diagram schematically showing a configuration example of the exposure apparatus of the embodiment. As shown in the figure, the exposure device 1 has an illumination system 10A, a lens system 10B, a position detection device 14 , a height detection device 16 , and a platform 18 . Moreover, the exposure apparatus 1 has a holding|maintenance part (not shown) which holds...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an exposure method, an exposure apparatus, and a manufacturing method of a semiconductor device. Embodiments provide an exposure method that can use height-related information for alignment correction. The exposure method includes acquiring first height information through detection of a height of an upper surface of a substrate subjected to exposure; acquiring first position information through detection of a relative position between the substrate and a first mask having a first pattern to be transferred on the substrate; converting the first height information to second position information; acquiring second height information through detection of a height of the upper surface of the substrate; acquiring third position information through detection of a relative position between the substrate and a second mask having a second pattern to be transferred on the substrate; converting the second height information to fourth position information; calculating differential position information, based on difference between the second position information and the fourth position information; and aligning the second mask and the substrate, based on the third position information and the differential position information.

Description

[0001] [Related applications] [0002] This application enjoys the priority of the basic application based on Japanese Patent Application No. 2020-050121 (filing date: March 19, 2020). This application includes the entire content of the basic application by referring to this basic application. technical field [0003] Embodiments of the present invention relate to an exposure method, an exposure apparatus, and a method of manufacturing a semiconductor device. Background technique [0004] In the exposure device, a designated optical system is used to project an original pattern on a substrate coated with a photoresist layer to expose the photoresist layer. When the original pattern is projected, the height detection device is used to measure the position of the substrate surface in the height direction, and based on the measurement result, the relative position of the substrate surface and the optical system is controlled. For example, in a semiconductor device such as a s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20G03F9/00H01L21/027
CPCG03F7/7085G03F7/70775G03F9/7003H01L21/0271G03F9/7026H01L22/20G03F7/70783G03F1/42H01L21/0274G03F7/7055
Inventor 寺井勇人高桑真步
Owner KIOXIA CORP