A kind of semiconductor stack member and its preparation method

Abstract

The present invention relates to a semiconductor stack member and its preparation method. First and second protrusions are respectively formed on the four sides of first and second semiconductor chips, and each of the first semiconductor chips A first groove is formed on the surface, a first bump is formed on each first protrusion in the first semiconductor chip, and a second groove is formed on the upper surface of each second semiconductor chip , and form a first cavity on each second protrusion in the second semiconductor chip, and then bond the second semiconductor chip to the first semiconductor chip, so that each of the first semiconductor chips Each first bump in the chip is embedded into a corresponding first cavity in the corresponding second semiconductor chip, thereby forming an air gap between the corresponding first and second semiconductor chips.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a semiconductor stacking component and a preparation method thereof. Background technique [0002] In the existing semiconductor stacking components, usually a plurality of semiconductor chips are stacked together through bonding materials, and then the stacked semiconductor chips are packaged with molding materials or underfill materials to form a semiconductor stack package structure. However, in the actual application process of the existing semiconductor stack package, since the semiconductor chip will generate heat during operation, heat transfer will occur between adjacent semiconductor chips, which will lead to mutual influence between adjacent semiconductor chips. In particular, when different types of semiconductor chips are stacked together, the performance of the semiconductor chips will be unstable, thereby affecting their service life. Contents of the inventi...

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Problems solved by technology

However, in the actual application process of the existing semiconductor stack package, since the semiconductor chip will generate heat during operation, heat transfer will occur between adjacent semiconductor chips, which will lead to mutual influence between adjacent semiconductor chips. Especially when different types of semiconductor chips are stacked together, the performance of the semiconductor chip will be unstable, which will affect its service life

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