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An infrared stealth superstructure compatible with thermovariable emissivity and frequency selective heat dissipation

A technology of frequency selection and emissivity, applied in the field of infrared stealth, can solve the problems of poor thermal stability and lack of emissivity modulation ability, and achieve the effect of wide emissivity control range

Active Publication Date: 2022-07-05
TSINGHUA UNIV
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Problems solved by technology

[0005] The purpose of the present invention is to solve the two problems of poor thermal stability and lack of emissivity modulation ability of traditional low-emissivity materials, combining metal resonant metamaterials and VO 2 Equal phase change materials, by designing the material composition of each dielectric layer of the metamaterial and controlling the structural size, an infrared stealth metasurface device compatible with thermally variable emissivity and frequency selective thermal emission is provided

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  • An infrared stealth superstructure compatible with thermovariable emissivity and frequency selective heat dissipation
  • An infrared stealth superstructure compatible with thermovariable emissivity and frequency selective heat dissipation
  • An infrared stealth superstructure compatible with thermovariable emissivity and frequency selective heat dissipation

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Embodiment Construction

[0018] In order to make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below with reference to the accompanying drawings and embodiments. It should be noted that, the embodiments in the present application and the features in the embodiments may be arbitrarily combined with each other if there is no conflict.

[0019] Many specific details are set forth in the following description to facilitate a full understanding of the present invention. However, the present invention can also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited by the specific implementation disclosed below. example limitations.

[0020] The infrared stealth superstructure of the embodiment of the present invention has both thermally variable emissivity and frequency-selective thermal emission performance. ...

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Abstract

The invention discloses an infrared stealth superstructure compatible with thermally variable emissivity and frequency selective heat dissipation. The emissivity regulation layer and the dielectric layer of the invention, as well as several metal pillars periodically arranged on the dielectric layer; the emissivity regulation layer is made by embedding phase change material in the metal layer stacked on the substrate. The invention can realize the modulation of the emissivity in the atmospheric transmission window: 3-5 μm and 8-14 μm, and at the same time enhance the thermal radiation in the atmospheric absorption band of 5-8 μm to actively dissipate heat, and has a wide emissivity control range, which can adapt to a variety of infrared Stealth scene.

Description

technical field [0001] The invention belongs to the technical field of infrared stealth, and in particular relates to an infrared stealth superstructure compatible with thermally variable emissivity and frequency selective heat dissipation. Background technique [0002] For most biological and working instruments, the surface temperature is between 20-900°C, according to Wien's displacement law (λT=b, where λ is wavelength, T is temperature, b is Wien's constant, b=0.002897m ·K), the thermal radiation peak will be distributed at 3-14 μm. However, the 3-5 μm and 8-14 μm bands are atmospheric transmission windows, and the infrared radiation in the windows can easily pass through the atmosphere and be detected by thermal cameras. Radiation contrast enables target identification in thermal imaging when there is a difference in radiation intensity between the target and the surrounding environment. How to integrate the target with the surrounding environment to avoid infrared t...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B5/22G02B5/20G02B1/00
CPCG02B5/22G02B5/208G02B1/002G02B1/00
Inventor 方菲赵越超
Owner TSINGHUA UNIV
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