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Printed wiring board and electronic device

A technology for printed wiring boards and electronic equipment, applied in printed circuits, printed circuits, printed circuit manufacturing, etc., can solve problems such as no solder formation, long-term reliability damage, and easy changes in the supply of molten solder, so as to reduce changes, The effect of reducing the amount of solder supplied

Pending Publication Date: 2021-10-22
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Since the printed wiring board disclosed in Patent Document 1 does not have a site that promotes the introduction of molten solder with respect to the soldering direction, although the occurrence of excessive solder can be reduced, there may be cases where no solder is formed.
In addition, even when no solder is formed, the supply amount of molten solder tends to fluctuate
As a result, the shape of the fillet of the solder joint differs depending on the electrode pad, and if a temperature cycle such as a temperature change caused by the use of the printed wiring board when it is assembled in the electronic device or a temperature change caused by the installation environment occurs, the There is a problem that thermal stress concentrates only on joints with a small amount of solder, leading to early fatigue failure and impairing long-term reliability

Method used

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  • Printed wiring board and electronic device
  • Printed wiring board and electronic device
  • Printed wiring board and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0020] figure 1 Is a plan view of a printed wiring board according to Embodiment 1 of the present invention. figure 2 A top view of the state of the sheet-shaped electronic component is mounted in the printed wiring board according to the first embodiment. image 3 It is a side view showing a state in which the printed wiring board is welded to the printing wiring plate according to the first embodiment. The printed wiring board 10 is provided with an electrode pad 2 for soldering the electrode 5a of the sheet-shaped electronic component 5. The substrate 1 of the printed wiring board 10 is formed of a material having an insulating property. For the substrate 1 of the printed wiring board 10, it is possible to exemplify the substrate formed in a glass web, a glass nonwoven fabric or a paper substrate, but is not limited to this. Further, in the front side of the electrode pad 2 in the welding direction, a molten solder 9 for introducing a jetflow state to the electrode pad 2 is int...

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PUM

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Abstract

This printed wiring board (10) comprises: a substrate (1); a plurality of electrode pads (2) for soldering electronic components and formed on the surface of the substrate (1); a molten solder introduction lug (3) which is formed on the surface of the substrate (1) connected to the electrode pads (2) and which draws molten solder to the electrode pads (2) during soldering; and a molten solder release lug (4) which is formed on the surface of the substrate (1) connected to the electrode pads (2), and which promotes the release of molten solder at the instant when molten solder is released. The molten solder introduction lug (3), the electrode pads (2) and molten solder release lug (4) are arranged in a row.

Description

Technical field [0001] The present invention relates to a printed wiring board having an electrode pad having an electrode having an electronic component and an electronic device including the printed wiring board. Background technique [0002] As a method of welding the electronic component to the printed wiring board, there is a jet welding method for impregnating the welding object in the molten solder. In the jet welding method, after the solder welding is applied in advance to the solder joints such as the electrode of the electrode pad or electronic component of the printed wiring board, heating is warmed. Thereby, the activation flux, the oxide film of the electrode surface is removed, and the cleaning state can be maintained. Thereafter, the spray solder of the molten state is in contact with the printed wiring board and the electronic component. When the molten solder is reliably contact with the solder joint, and when the molten solder is stably disengaged, the normal w...

Claims

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Application Information

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IPC IPC(8): H05K3/34
CPCH05K3/341H05K1/111H05K2203/044H05K2203/0445H05K2201/09418H05K2201/09381H05K1/181H05K2203/042
Inventor 重田晃二森田真人波越和生小岛知高海野完二原田忧哉
Owner MITSUBISHI ELECTRIC CORP