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Material carrying platform, machining method thereof and hot pressing device

A processing method and technology of a hot pressing device, which are applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve problems such as product quality decline

Active Publication Date: 2021-10-29
东莞联鹏智能装备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Based on this, it is necessary to provide a loading platform and its processing method and a hot pressing device for the problem of product quality degradation caused by the current loading platform hot pressing products

Method used

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  • Material carrying platform, machining method thereof and hot pressing device
  • Material carrying platform, machining method thereof and hot pressing device
  • Material carrying platform, machining method thereof and hot pressing device

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Embodiment Construction

[0037] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0038] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counte...

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Abstract

The invention relates to a material carrying platform, a machining method and a hot pressing device. The material carrying platform comprises a material bearing table and a heat insulation plate; the heat insulation plate is arranged on the side, used for bearing a product, of the material bearing table and used for isolating heat from being transmitted to the material bearing table, the thermal expansion coefficient of the heat insulation plate is smaller than 6 * 10 <-7 > / DEG C, the heat conductivity coefficient of the heat insulation plate is smaller than 1.6 W / mK. Through the heat insulation plate, heat transferred from a hot pressing head to the material bearing table is reduced. According to the material carrying platform, through the heat insulation plate, the heat transferred from the hot pressing head to the material carrying platform is reduced. Therefore, the heat of the hot-pressing head is only gathered below the hot-pressing head and is not diffused to the whole material loading platform, so that the quality of a hot-pressed product is ensured.

Description

technical field [0001] The invention relates to the technical field of semiconductor device processing, in particular to a material-carrying platform, a processing method thereof, and a hot-pressing device. Background technique [0002] Hot press (hot press device) is also called bonding machine, which can be divided into solder, ACF (Anisotropic Conductive Film, anisotropic conductive tape), ACP (Anisotropic conductive paste / adhesive, anisotropic conductive paste) according to different hot pressing media Glue), TBF (Thermal Bonding Film, hot melt adhesive film) bonding machine. Suitable for FPC (Flexible Printed Circuit, flexible circuit board), HSC (Heat Seal Connecto, zebra paper), TAB (Tape Automated Bonding, automatic welding of carrier tape), LCD (Liquid Crystal Display, liquid crystal display) and PCB (Printed Circuit Board , printed circuit board) connections. [0003] The heat press includes a loading platform, which is used to place glass or PCB and FPC componen...

Claims

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Application Information

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IPC IPC(8): H01L21/673H01L21/683H01L21/687B23P15/00
CPCH01L21/67336H01L21/6838H01L21/687B23P15/00
Inventor 李立辉范杰李良廖玉红刘思文
Owner 东莞联鹏智能装备有限公司
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