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Resin composition, photoresist composition and patterning method

A resin composition and composition technology, applied in the field of photolithography, can solve the problems of slow sensitivity and achieve the effect of high sensitivity and high resolution

Pending Publication Date: 2021-11-02
BEIJNG ASAHI ELECTRONICS MATERIAL CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the current photolithography technology, the sensitivity and resolution of the phenolic resin-diazonaphthoquinone system photoresist usually show an opposite trend. Generally, the higher the resolution, the slower the sensitivity.

Method used

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  • Resin composition, photoresist composition and patterning method
  • Resin composition, photoresist composition and patterning method
  • Resin composition, photoresist composition and patterning method

Examples

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Embodiment 7

[0093] In Examples 7-10, the content of the second resin in the resin composition is 80%, and the resin composition contains two or three kinds of second resin. according to Figure 1 ~ Figure 4 It can be seen that the resolution of the photoresist provided in Example 7 can reach 1.5 μm, the resolution of the photoresist provided in Example 8 can reach 1.3 μm, and the resolution of the photoresist provided in Example 9 can reach 1.2 μm, The resolution of the photoresist provided in Example 10 can reach 1.3 μm.

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Abstract

The invention provides a resin composition, a photoresist composition and a patterning method, and belongs to the technical field of photoetching. The resin composition comprises the following components in percentage by mass: 20-50% of first resin and 50-80% of second resin, the structure of the first resin is shown as a formula I; the structure of the second resin is shown as a formula II-1 or a formula II-2. The resin composition contains at least two kinds of second resin with different xylenol structural unit mass percentages, and the mass percentage of the second resin with the xylenol structural unit mass percentage larger than or equal to 30% is smaller than 60%. The photoresist composition comprises the following components in percentage by mass: 70-85% of a solvent, 1-10% of a photosensitizer and 10-20% of a resin composition, the photosensitizer comprises a G-line photosensitizer and an I-line photosensitizer. The resin composition is applied to the photoresist, so that the photoresist has relatively high resolution and relatively high sensitivity.

Description

technical field [0001] The present application relates to the technical field of photolithography, in particular, to a resin composition, a photoresist composition and a patterning method. Background technique [0002] OLED is a new generation of display technology after LCD. The biggest technical difference between OLED and LCD is actually whether it is "self-illuminating". The structure of OLED is simpler, and the essential difference that each pixel can control its own light emission has formed a natural technical barrier between OLED and LCD. It is precisely because of the self-illumination feature that the OLED screen can not emit light at all when displaying black, and the OLED screen can display perfect picture contrast, and the display picture will be more vivid and real. Therefore, OLED is the trend of future display. [0003] Photoresist is the key basic material in photolithography technology, and it is also one of the important upstream materials for OLED panel...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/00
CPCG03F7/004G03F7/0045G03F7/00
Inventor 胡凡华张腾何卿刘洪雷方兵朴大然卢克军张宁
Owner BEIJNG ASAHI ELECTRONICS MATERIAL CO LTD
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