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Photosensitive resin composition, photocurable pattern and method for forming photocurable pattern

A technology of photosensitive resin and composition, applied in the fields of photosensitive resin composition, photocurable pattern and formation of photocurable pattern, can solve the problem of unmentioned resistance to water boiling, hardness and high temperature outgassing, and limit the combination of photosensitive resin It can solve the problems such as the use of materials and the easy aging and yellowing of light-cured patterns, and achieve the effects of excellent glass and metal adhesion, fast sensitivity and high hardness.

Active Publication Date: 2019-10-11
南雄市毅豪化工有限公司
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This not only makes the resulting photocured pattern easy to age and yellow, but also limits the use of the photosensitive resin composition in display elements with poor heat resistance.
However, if the traditional photosensitive resin composition is used for low temperature curing, there will be problems such as incomplete curing, poor chemical resistance, poor adhesion and low hardness.
[0006] Chinese patent application No. 201511030970.7 discloses a negative photosensitive resin composition curable at low temperature. Novolac oligomer-based curing agent and polyfunctional thiol compound containing more than three functions endow it with a pattern with good chemical resistance under low temperature curing conditions, but it does not mention the boiling resistance and hardness of the photocured pattern. and high temperature outgassing

Method used

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  • Photosensitive resin composition, photocurable pattern and method for forming photocurable pattern
  • Photosensitive resin composition, photocurable pattern and method for forming photocurable pattern
  • Photosensitive resin composition, photocurable pattern and method for forming photocurable pattern

Examples

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Effect test

preparation example Construction

[0058] The preparation method of the photosensitive resin composition is as follows: 10-30 parts by mass of alkali-soluble aminoacrylic acid polymer A, 5-15 parts by mass of polyfunctional unsaturated urethane acrylate polymer B, 1-5 parts by mass The acrylic monomer C, 1-5 parts by mass of the photoinitiator D and 30-80 parts by mass of the organic solvent E are mixed, stirred evenly with a mechanical stirrer, and the photosensitive resin composition can be obtained.

[0059] The present invention also proposes a photocurable pattern, which is formed by using the photosensitive resin composition of the present invention.

[0060] The method for forming a photocurable pattern with the above photosensitive resin composition is as follows: coat the photosensitive resin composition on the base material to form a film, and pre-bake it at 80° C. to 100° C. for 2 to 5 minutes; The mask plate to be patterned is covered on the surface-dried film, and exposed with a 365nm high-pressure...

Embodiment 1

[0066] 30 mass parts of alkali-soluble aminoacrylic acid polymer A, 5 mass parts of polyfunctional unsaturated urethane acrylate polymer B, 1 mass part of acrylic monomer C, 4 mass parts of photoinitiator D and 80 mass parts The organic solvent E was mixed, stirred evenly with a mechanical stirrer, and the photosensitive resin composition of Example 1 was obtained. The obtained photosensitive resin composition was formed according to the above-mentioned method for forming a photocured pattern (photolithography process), to obtain a photocured pattern, and the photocured pattern was evaluated by the following evaluation method, and the evaluation results are shown in Table 2.

[0067] Example 2 to Example 6 and Comparative Example 1 to Comparative Example 3 are the same as Example 1 in the production method and evaluation method, the difference lies in the photosensitivity used in Example 2 to Example 6 and Comparative Example 1 to Comparative Example 3 The amount of raw materi...

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Abstract

The invention discloses a photosensitive resin composition. The photosensitive resin composition is prepared from the following components in parts by weight: 10 to 30 parts of an alkali solubility amino acrylic polymer A, 5 to 15 parts of an unsaturated urethane acrylate polymer B with multifunctional groups, 1 to 5 parts of an acrylic ester monomer C, 1 to 5 parts of a photoinitiator D and 30 to 80 parts of an organic solvent E. The photosensitive resin composition disclosed by the invention can be used for low-temperature curing, and is high in insulation performance, chemical resistance, adhesive force and the like; moreover, a high-fineness pattern requirement can be met by a pattern formed by the photosensitive resin composition; and meanwhile, the photosensitive resin composition is low in high-temperature gas release and also can be used for high-temperature curing. The photosensitive resin composition is mainly used in the technical field of ultraviolet light curing and the fields of liquid crystal display manufacturing and capacitive touch screen manufacturing.

Description

technical field [0001] The invention relates to a photosensitive resin composition capable of curing at low temperature, in particular to a photosensitive resin composition that does not need to add additives and curing agents, and can have excellent glass and metal adhesion, excellent resistance to strong acid and strong alkali, A photosensitive resin composition with good water boiling resistance and high hardness, and has the characteristics of fast sensitivity, high resolution and low high-temperature outgassing, which can meet the needs of high-temperature curing at the same time. [0002] technical background [0003] With the continuous development of science and technology, in the field of displays, photosensitive resin compositions have been widely used for their excellent insulation, chemical resistance, heat resistance and adhesion, replacing traditional spherical spacers. The photosensitive resin composition coats the material on the target substrate, and after th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/027G03F7/004
Inventor 黄珍荣顾奇王胜林
Owner 南雄市毅豪化工有限公司
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