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Cutting method for cutting glass through laser

A technology of laser cutting and cutting methods, applied in laser welding equipment, welding/welding/cutting items, manufacturing tools, etc., can solve the problems of low cutting yield, achieve the effect of improving cutting yield and overcoming low yield

Active Publication Date: 2021-11-09
WUHAN RAYCUS FIBER LASER TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The embodiment of the present application provides a cutting method of laser cutting glass to solve the problem of low cutting yield of existing laser cutting thick glass

Method used

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  • Cutting method for cutting glass through laser
  • Cutting method for cutting glass through laser
  • Cutting method for cutting glass through laser

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Embodiment Construction

[0017] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0018] An embodiment of the present application provides a method for cutting laser-cut glass to solve the problem of low cutting yield in existing laser-cut thick glass. It will be described below in conjunction with the accompanying drawings.

[0019] see figure 1 as shown, figure 1 It is a device structure diagram of the laser cutting device used in the embodiment of this application.

[0020] In order to realize the cutting method of the embodiment of the present applicat...

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Abstract

The invention provides a cutting method for cutting glass through laser. The cutting method comprises the steps that a laser cutting device presets cutting parameters; the laser cutting device generates a laser beam according to the preset cutting parameters, the focus of the laser beam acts on the to-be-cut glass, the to-be-cut glass generates a modified area under the action of the focus, and the width of the modified area is narrowed from one side surface of the to-be-cut glass to the other side in the thickness direction of the to-be-cut glass; and laser generated by the laser device acts on the modified area, and the to-be-cut glass cracks. According to the invention, the stress difference generated in the thickness direction of the to-be-cut glass is sharply increased, so that the to-be-cut glass rapidly cracks.

Description

technical field [0001] The present application belongs to the technical field of laser processing, and in particular relates to a cutting method of laser cutting glass. Background technique [0002] In the prior art, laser cutting of glass generally adopts laser stealth cutting technology or Bezier cutting technology. Laser stealth cutting technology is to make a single pulse of pulsed laser through optical shaping, let it focus inside the glass material through the surface of the glass material, and the energy density in the focal area is high, forming a multi-photon absorption nonlinear absorption effect, so that the material is modified Cracks are formed, and then completely separated by mechanical means. Due to the insufficient depth of focus, laser stealth cutting technology is only suitable for thin glass; Bessel cutting technology uses the long-focus Bessel beam formed by the Bessel cutting head to focus on the In the vitreous body, it has a good effect when cutting ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/402
CPCB23K26/38B23K26/402B23K2103/54
Inventor 李俊白娟娟李雅琪底才翔丁诚超高辉吴泽锋闫大鹏
Owner WUHAN RAYCUS FIBER LASER TECHNOLOGY CO LTD