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Moistureproofing chip on film package

A technology of chip-on-chip film and moisture-proof tape, which is applied in the direction of film/flaky adhesives, semiconductor/solid device parts, semiconductor devices, etc., can solve problems such as short-circuit electrical faults, and achieve the effect of improving product reliability

Inactive Publication Date: 2021-11-12
SILICON WORKS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, electrical failures such as short circuits due to actions such as ion migration may occur in the conductive pattern of the COF package

Method used

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  • Moistureproofing chip on film package
  • Moistureproofing chip on film package
  • Moistureproofing chip on film package

Examples

Experimental program
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Embodiment Construction

[0019] Exemplary embodiments will be described in more detail below with reference to the accompanying drawings. However, this disclosure may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. Throughout this disclosure, like reference numerals refer to like parts in the various drawings and embodiments of the disclosure.

[0020] Embodiments of the present disclosure disclose a driver integrated circuit manufactured in the form of a COF package. A driver integrated circuit manufactured in the form of a semiconductor chip is mounted on the COF package. A COF package according to an embodiment of the present disclosure is configured to have a moisture-proof function.

[0021] The present disclosure is implemented to achieve a moisture-proof function ...

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PUM

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Abstract

The present disclosure discloses a moistureproofing chip on film (COF) package for protecting the conductive pattern of the COF package against moisture. The moistureproofing COF package includes a base film having a conductive pattern formed on one surface thereof and having a solder resist formed on the conductive pattern and a moistureproofing tape attached to the top of the solder resist and configured to block moisture from being delivered to the conductive pattern through the solder resist.

Description

technical field [0001] The present disclosure relates to a chip-on-film package (hereinafter referred to as a “COF package”), and more particularly, to a moisture-proof COF package for protecting a conductive pattern of the COF package from moisture. Background technique [0002] A display device includes a display panel such as an LCD panel or an LED panel, and a driving integrated circuit for processing display data. [0003] Wherein, the driving integrated circuit is configured to process display data provided from outside, and provide an image signal corresponding to the display data to the display panel. The display panel may display a screen based on an image signal driving the integrated circuit. [0004] Generally, a driver integrated circuit is manufactured in the form of a COF package and mounted on a display panel. [0005] Driver ICs manufactured in the form of COF packages are generally used without moisture-proof treatment. In addition, the solder mask appli...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/00H01L23/31
CPCH01L23/564H01L23/3107H01L23/49894H01L23/4985H01L23/3121H01L24/12H01L21/481H01L2224/73204H01L2224/16225H01L2224/32225H01L2924/00012H01L23/3135H01L23/495C09J7/22C09J7/401H01L23/293H01L23/3185H01L2224/73253H01L24/73
Inventor 河潭金倞铉
Owner SILICON WORKS CO LTD