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Mica plate reinforced by fine-grained mica

A fine-grained, mica board technology, applied in the field of mica boards, can solve the problems of mica paper making and waste of mica resources, etc., achieve excellent electrical insulation performance, reduce dielectric loss, and solve waste problems.

Active Publication Date: 2021-11-16
怀化鑫崀峰钙业有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there is still a part of fine-grained mica (particle size ≤ 70 μm) in the mica scrap that cannot be used for mica paper making, resulting in a waste of mica resources

Method used

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  • Mica plate reinforced by fine-grained mica

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Embodiment Construction

[0019] In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the present invention will be further described below in conjunction with specific diagrams and specific embodiments.

[0020] In the following embodiments, those skilled in the art can understand that unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms such as those defined in commonly used dictionaries should be understood to have a meaning consistent with the meaning in the context of the prior art, and will not be interpreted in an idealized or overly formal sense unless defined as herein Explanation.

[0021] see figure 1 The preferred embodiment of the mica plate reinforced with fine-grained mica is shown. In the embodiment, the mica plate ...

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Abstract

The invention discloses a mica plate reinforced by fine-grained mica. The mica plate is formed by hot pressing after a plurality of laminating units are laminated. Each laminating unit comprises two layers of mica paper and a reinforcing mica paper layer formed between the two layers of mica paper, and the adjacent laminating units are adhered through an adhesive. The reinforcing mica paper layers are prepared by mixing mixed mica powder and a resin material, adding water, stirring and mixing to prepare mica paper pulp, and the thickness of each reinforcing mica paper layer is 2-3 times that of the mica paper. The adhesive uses the resin material as a sizing material, and reinforcing fibers, fine-grained mica flakes and a modified filler are uniformly dispersed in the sizing material. The mica plate prepared by the invention has good electrical performance and physical performance, and fine-grained mica can be utilized.

Description

technical field [0001] The invention relates to the field of insulating mica products, in particular to a mica board reinforced with fine-grained mica. Background technique [0002] In recent years, with the continuous development of my country's economy and the advancement of science and technology, the demand for mica insulation products in industrial applications has become higher and higher. Mica is a general term for a class of hydrous aluminosilicates. Mica has excellent insulation and high temperature resistance. It has a wide range of applications in the electrical industry. However, as a natural mineral, mica has limited resources, and in the prior art, mica flakes are processed from raw mica ore, and the utilization rate of mica is only about 3% to 10%, and a large amount of mica fragments and slag have been accumulated for many years. [0003] In order to make full use of crushed mica resources, mica paper came into being, and making mica into mica paper is one of...

Claims

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Application Information

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IPC IPC(8): D21H13/44D21H27/30B32B17/02
CPCD21H13/44D21H27/30B32B17/02
Inventor 张建军张平
Owner 怀化鑫崀峰钙业有限公司
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