Packaging structure of power module and packaging method thereof

Abstract

The invention discloses a packaging structure of a power module and a packaging method thereof. The packaging structure of the power module comprises a power module main body, wherein the bottom parts of the two sides of the power module main body are fixedly connected with rectangular clamping sleeves, the bottom of the power module main body is movably contacted with a concentric-square-shaped frame, L-shaped fixing frames are fixedly connected to the two sides of the bottom of the concentric-square-shaped frame, a heat dissipation plate is fixedly connected into the concentric-square-shaped frame, and the top of the heat dissipation plate is in movable contact with the bottom of the power module main body. According to the invention, the packaging cover can be quickly disassembled and assembled, the power module main body can be quickly and independently disassembled and replaced, the heat dissipation part and the packaging cover part do not need to be integrally replaced, the long-term repair and replacement cost is reduced, the power module main body can be automatically and elastically tightened and pressed during packaging, the power module main body can be always in continuous and stable contact with the heat dissipation plate, the separation risk caused by vibration and other factors is reduced, the combination heat conduction stability is improved, and the use requirements are met.

Description

technical field [0001] The present invention relates to the technical field of power module packaging, in particular to a power module packaging structure and a packaging method thereof. Background technique [0002] Insulated gate bipolar transistor modules are more and more widely used in inverters, inverter welding machines, induction heating, rail transit, wind energy, solar power generation, new energy vehicles and other fields, especially power modules, and the high integration of power modules To meet the lightweight requirements of the vehicle, the structure and circuit reliability and integration of the power module are also required to be higher, and the power module needs to be packaged during production. [0003] The existing power module packaging structure is basically packaged by crimping or welding. When the power module is damaged, it cannot be disassembled and maintained. cost; [0004] In general, it has two major defects; one is that it is inconvenient ...

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Problems solved by technology

[0003] The existing power module packaging structure is basically packaged by crimping or welding. When the power module is damaged, it cannot be disassembled and maintained. cost;

[0004] In general, it has two major defects; one is that it is inconvenient to disassemble and replace the power module quickly and independently; the other is that it is not convenient to keep the continuous and stable contact between the power module and the cooling The method increases the long-term use cost; and in the driving vibration, the traditional fixing method is easy to cause the separation of the power module and the heat sink due to vibration and other factors, resulting in heat transfer failure and unstable combination), which cannot meet the use requirements. phenomenon, so we propose a power module packaging structure and its packaging method to solve the above problems

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