Transparent material processing system and method based on laser processing

Abstract

The invention discloses a transparent material processing system and method based on laser processing. The method comprises the steps that firstly, a pre-splitting groove is cut in an internal region of a to-be-cut trajectory of a transparent material in a laser etching manner; then, a Bessel beam of a Bessel laser cutter is controlled to move along the to-be-cut trajectory of the transparent material, so that a cutting track is formed on the transparent material; and finally, cutting laser emitted by a splitting device is controlled to move along the cutting track formed by the Bessel laser cutter, so that excess materials between the cutting track and the pre-splitting groove fall off. According to the transparent material processing system and method based on laser processing, through the cutting mode of combining the Bessel beam and laser etching, even for a complex cutting pattern or a cutting environment with an inner groove, a cutting area can be easily split, and the quality of a notch is effectively ensured.

Description

technical field [0001] The invention relates to the technical field of transparent material processing, in particular to a laser processing-based transparent material processing system and method. Background technique [0002] For transparent materials, such as glass, it can be processed by laser cutting to obtain high-quality cut surfaces. At present, there are mainly two methods for laser processing of glass transparent materials, one is Bessel beam cutting, and the other is cutting directly from the surface of the material with a combination of galvanometer and telecentric field mirror. These two methods have certain limitations and defects when processing glass-like transparent materials. When processing glass-like transparent materials with Bessel beams, since the Bessel beams are hot-melt cutting, the light enters the interior of the transparent material and melts the cutting surface from the inside of the material, and the cutting surface has an expansion effect afte...

AI Technical Summary

Problems solved by technology

When processing glass-like transparent materials with Bessel beams, since the Bessel beams are hot-melt cutting, the light enters the interior of the transparent material and melts the cutting surface from the inside of the material, and the cutting surface has an expansion effect after melting, so it is not easy to cut the desired The cutting area is cracked. In this way, for more complex graphics or inner groove cutting, it often poses a great challenge to the subsequent splitting process, and even the splitting cannot be completed.

When the combination of vibrating mirror and telecentric field mirror is used to process glass-like transparent materials, it is cut from top to bottom on the surface of the workpiece, which can easily crack the cut piece, but the cutting surface is not smooth and vertical enough, often forming a certain The taper cannot meet the user's requirements for the quality of the cutting surface. In addition, cutting from the top to the bottom of the surface will leave a certain amount of stress in the workpiece, which is often unacceptable to customers in some application fields

Images