Resonant differential pressure sensor integrated with temperature sensor and preparation method thereof

Abstract

The invention discloses a resonant differential pressure sensor integrated with a temperature sensor and a preparation method thereof, the resonant differential pressure sensor comprises a sensor sensing unit and a packaging cover plate, and the sensor sensing unit and the packaging cover plate are bonded together through an anode; the sensor sensing unit comprises a substrate layer and a device layer, and a temperature sensor and a first pressure sensitive film are arranged on the substrate layer; a first resonator, a second resonator and a third resonator are arranged on the device layer, the first resonator and the second resonator are located in the middle area and the edge area of the first pressure sensitive film area respectively, and the third resonator is located on a frame outside the sensitive film area; the packaging cover plate comprises a silicon layer and a glass layer which are bonded together through an anode; a second pressure sensitive film is arranged on the silicon layer; and a getter groove is arranged on the glass layer. The temperature sensor can accurately monitor the temperature when the resonant differential pressure sensor works, and the measurement error of the sensor caused by the temperature is corrected in real time.

Description

technical field [0001] The invention relates to the field of silicon resonant pressure sensors, in particular to a resonant differential pressure sensor integrated with a temperature sensor and a preparation method thereof. Background technique [0002] The resonant MEMS differential pressure sensor has excellent characteristics such as quasi-digital output, good long-term stability, high precision and high resolution, and strong anti-interference ability, so it is widely used in automotive electronics, medical electronics, industrial control, aerospace, etc. field. [0003] The core structure of the resonant differential pressure sensor resonator needs to work in a vacuum environment. On the one hand, the resonator can have a high quality factor, and on the other hand, it can protect the resonator from the interference of external humidity and dust. Therefore, vacuum packaging is an important point in the research content of resonant differential pressure sensors. [0004...

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Problems solved by technology

[0008] The main purpose of the present invention is to provide a resonant differential pressure sensor with an integrated temperature sensor and its preparation method. The resonant differential pressure sensor is manufactured by using anodic bonding as the core process, which simplifies the problem of complicated process in the prior art. Make a temperature sensor on the chip to solve the problem of inaccurate temperature measurement of the resonator for temperature compensation

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