Polishing pad self-finishing polishing device and using method thereof

The technology of polishing device and polishing pad is applied in the direction of grinding drive device, grinding/polishing equipment, machine tool for surface polishing, etc., which can solve the problems of large difference in protrusion height, multiple scratches, and reduced surface quality of workpiece, etc. Achieve the effect of improving stability and efficiency, achieving efficient precision machining, and improving surface quality

Inactive Publication Date: 2021-11-30
JINLING INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the prior art, manual trimming is mostly used for the trimming of hydrophilic polishing pads, so there will be incomplete trimming of the polishing pads, that is, the invalid abrasive grains in the polishing pads cannot be effectively removed; after the manual trimming, the polishing pads The flatness of the polishing pad becomes larger, so that the difference in the raised height of the effective abrasive grains in the just-dressed polishing pad is large, that is, the stability of the polishing quality of the polishing pad is reduced, and the surface of the workpiece is not sufficiently polished during the polishing process, resulting in more scratches. marks, thereby reducing the surface quality of the polished workpiece

Method used

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  • Polishing pad self-finishing polishing device and using method thereof
  • Polishing pad self-finishing polishing device and using method thereof
  • Polishing pad self-finishing polishing device and using method thereof

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Embodiment Construction

[0021] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0022] like Figure 1 to Figure 6 As shown, a polishing pad self-conditioning polishing device according to the present invention includes a housing 1, a trimming module 2, a polishing module 3, a polishing disc 4, a transmission shaft 5, a driving module 6, a polishing pad 7 and a controller. The casing 1 is placed horizontally, and the casing 1 is used to support each module.

[0023] The trimming module 2 is installed on the upper right end of the housing 1 , and the trimming module 2 is used for trimming the polishing pad 7 on the polishing disc 4 . The polishing module 3 is located at the upper left end of the casing 1, and the polishing module 3 is used for polishing the workpiece. The polishing disc 4 is located on the upper part of the i...

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PUM

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Abstract

The invention belongs to the technical field of precision machining, and particularly relates to a polishing pad self-finishing polishing device and a using method thereof. The polishing pad self-finishing polishing device comprises a shell, a finishing module, a polishing module, a polishing disc, a transmission shaft, a driving module, a polishing pad and a controller; the shell is placed horizontally; the finishing module is installed at the right end of the upper side of the shell; the polishing module is located at the left end of the upper side of the shell; the polishing disc is located at the upper part of an inner cavity of the shell and used for containing the polishing pad; the polishing pad adheres to the upper side of the polishing disc; the upper end of the transmission shaft is connected with the polishing disc, and the lower end of the transmission shaft is connected with the driving module; the driving module is used for driving the polishing disc to rotate; the controller is used for controlling work of each module. According to the polishing device, the finishing module, the polishing disc, the polishing module and the transmission shaft are matched to work, so that high-flatness polishing can be carried out on a workpiece, the surface quality of the polished workpiece is effectively improved, and then efficient and precise machining of the workpiece is realized.

Description

technical field [0001] The invention belongs to the technical field of precision machining, and in particular relates to a polishing pad self-conditioning polishing device and a using method thereof. Background technique [0002] The polishing pad self-dressing is mainly used in the polishing process to dress the polishing pad, which can remove the polishing impurities generated during the polishing process, and prevent the polishing impurities from clogging the groove of the polishing pad, which will affect the use effect of the entire polishing pad. It can be seen that if the polishing pad self-conditioning polishing device can timely and effectively remove impurities generated during the polishing process, the polishing effect of the polishing pad can be effectively maintained, thereby increasing the service life of the polishing pad. [0003] It can be seen from the above that the quality of the polishing pad directly affects the surface quality of the polished workpiece...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/00B24B53/12B24B53/00B24B41/04B24B41/02B24B49/00B24B47/04B24B41/00
CPCB24B29/00B24B53/12B24B53/005B24B41/04B24B41/02B24B49/003B24B47/04B24B41/007
Inventor 牛瑞坤王欢涛吴钟鸣
Owner JINLING INST OF TECH
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