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Semiconductor packaging structure and manufacturing method thereof

A packaging structure, semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the imbalance of wire bonding force, affect the electrical connection, and the wire bonding force is easily absorbed by organic materials, etc. problems, to achieve the effect of improving the strength of the wire and increasing the strength of the structure

Pending Publication Date: 2021-11-30
ADVANCED SEMICON ENG INC
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  • Abstract
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Problems solved by technology

[0002] Wire bonding (Wire Bonding) packaging technology is to place the chip on the rewiring structure, and then connect the chip to the pad on the rewiring structure with wires, but the rewiring formed by stacking multiple layers of rewiring Due to the uneven surface of the structure, the bonding force is unbalanced, and the organic material in the rewiring structure has low rigidity, and the bonding force is easily absorbed by the organic material, thus causing poor bonding between the solder joints and the pads of the wire bonding, which affects the electrical connection. The effect of sexual connection

Method used

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  • Semiconductor packaging structure and manufacturing method thereof
  • Semiconductor packaging structure and manufacturing method thereof
  • Semiconductor packaging structure and manufacturing method thereof

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Embodiment Construction

[0037] The specific implementation manners of the present disclosure will be described below in conjunction with the accompanying drawings and examples. Those skilled in the art can easily understand the technical problems solved by the present disclosure and the technical effects produced through the contents recorded in this specification. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. In addition, for the convenience of description, only the parts related to the related invention are shown in the drawings.

[0038] It should be noted that the structures, proportions, sizes, etc. shown in the accompanying drawings of the specification are only used to match the content recorded in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present disclosure. There are limited conditions, so it has...

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Abstract

The invention provides a semiconductor packaging structure and a manufacturing method thereof. Lead bonding is directly welded on the lowermost redistribution layer in a redistribution structure and is not influenced by an organic material, or the lead bonding is welded on a bonding pad with a supporting structure, and the supporting structure can increase the structural strength so as to achieve the effect of improving the wire bonding strength.

Description

technical field [0001] The present disclosure relates to the field of semiconductor technology, in particular to a semiconductor package structure and a manufacturing method thereof. Background technique [0002] Wire bonding (Wire Bonding) packaging technology is to place the chip on the rewiring structure, and then connect the chip to the pad on the rewiring structure with wires, but the rewiring formed by stacking multiple layers of rewiring Due to the uneven surface of the structure, the bonding force is unbalanced, and the organic material in the rewiring structure has low rigidity, and the bonding force is easily absorbed by the organic material, thus causing poor bonding between the solder joints and the pads of the wire bonding, which affects the electrical connection. The effect of sexual connection. Contents of the invention [0003] The present disclosure provides a semiconductor package structure and a method of manufacturing the same. [0004] In a first asp...

Claims

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Application Information

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IPC IPC(8): H01L23/49H01L21/48
CPCH01L23/49H01L21/4889H01L2224/48471H01L2224/48228H01L2224/92247H01L2224/48091H01L2224/48227H01L2224/73265H01L2224/32225H01L2924/00014H01L2924/00
Inventor 张勇舜李德章洪志斌
Owner ADVANCED SEMICON ENG INC
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