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Method and photolithography device for correcting tilt error of workpiece table

A technology of tilt error and workpiece table, which is applied in the exposure device of photolithography process, microlithography exposure equipment, optics, etc., can solve the problem of low measurement accuracy, achieve high calibration accuracy, save cost, and improve the effect of correction accuracy

Active Publication Date: 2022-06-03
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] What the present invention aims to solve is the problem of how to correct the inclination error of the workpiece table when the measurement accuracy of the vertical position of the focusing and leveling sensor in the prior art is low even when there is no focusing and leveling sensor

Method used

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  • Method and photolithography device for correcting tilt error of workpiece table
  • Method and photolithography device for correcting tilt error of workpiece table
  • Method and photolithography device for correcting tilt error of workpiece table

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Embodiment Construction

[0068] These terms so used may be substituted under appropriate circumstances. Similarly, if the method described herein includes a

[0069] As shown in FIG. 2, in the exemplary embodiment of the present invention, the used projection lithography machine includes an illumination system 100, a

[0074] S200: for each of the exposure positions, according to the characteristics of the exposure image in the exposure field corresponding to the exposure position

[0075] S300: According to the exposure position and the corresponding sub-tilt errors formed by several groups of data, obtain

[0082] S100: Move the workpiece table several times in the same direction, and each time it moves to an exposure position, correct the calibration mark

[0084] S200: for each of the exposure positions, according to the characteristics of the exposure image in the exposure field corresponding to the exposure position

[0087] Z

[0089] S300: According to several sets of data formed by the exposure p...

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Abstract

The invention provides a method for correcting the inclination error of the workpiece table and a photolithographic device. The correction method includes moving the workpiece table several times along the same direction, so that the correction mark generates exposure images of several exposure fields on the substrate; for each In the exposure field, according to the characteristics of the exposure image and the focusing parameters, a sub-tilt error at each exposure position is obtained; according to the sub-tilt error and the exposure position, a corresponding relationship between the tilt error and the position of the workpiece table in the moving direction is obtained; and Correct the workpiece table accordingly. The method for correcting the inclination error of the workpiece table provided by the invention can conveniently obtain the inclination deviation in the movement process of the workpiece table and improve the positioning accuracy of the workpiece table. Moreover, it can be used when there is no focus and leveling sensor at the exposure position, and the vertical position of the mark obtained through alignment measurement has better repeatability than the vertical position measured by the focus and leveling sensor, and the calibration accuracy is higher, improving the lithography machine system accuracy.

Description

Method and lithography device for correcting tilt error of workpiece stage technical field The present invention relates to semiconductor technology field, relate in particular to the method for calibrating tilt error of workpiece stage and lithography machine design [0001] ready. Background technique [0002] A projection lithography machine is a device that projects a pattern on a mask onto the upper surface of a substrate through an objective lens. and usually In this case, the workpiece stage of the lithography machine needs to be calibrated to ensure that the mask pattern can be projected onto the substrate surface according to the design requirements. correct location. As shown in accompanying drawing 1, if there is unevenness or deformation of surface shape in Y direction of elongated mirror, can make interferometer model The normal state 102 in which the workpiece table is not tilted in FIG. 1 is mistaken for the workpiece table in a tilted state, and the wo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70725G03F7/7085
Inventor 杨泽雷
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD