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Inductor device and process of production thereof

An inductance and device technology, applied in the field of inductance devices and their manufacturing, can solve problems such as unfavorable productivity and complicated methods, and achieve the effect of suppressing stacking deviation

Inactive Publication Date: 2004-02-04
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, they are more complex than prior art methods and are therefore disadvantageous from a productivity point of view

Method used

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  • Inductor device and process of production thereof
  • Inductor device and process of production thereof
  • Inductor device and process of production thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0041] like figure 1 As shown, the inductive component according to the first exemplary embodiment has a component body 1 . The device body 1 has end portions 3a and 3b integrally formed on both ends thereof. The device body further has coil patterns 2 a and 2 b laminated alternately inside it between insulating layers 7 . In this embodiment, the end of the coil pattern unit 2c stacked on the top is connected to one end 3a, and the end of the coil pattern unit 2d stacked on the bottom is connected to the other end 3b. These coil pattern units 2a, 2b, 2c, and 2d are connected through via holes 4 formed in the insulating layer 7, and constitute the coil 2 together.

[0042] The insulating layer 7 constituting the device body 1 can be made of, for example, ferrite, ferrite-glass composite, or other magnetic materials, or alumina-glass composite, crystallized glass, or other dielectric materials. The coil pattern units 2a, 2b, 2c, and 2d may be composed of, for example, silver,...

no. 2 example

[0062] In the inductance array device (type of inductance device) according to the second embodiment of the present invention, as Figure 6 As shown in , many coils 102 are arranged inside a single device body 101 along the longitudinal direction of the device body 101 . A number of end portions 103 a and 103 b are formed on side ends of the device body 101 corresponding to the coil 102 .

[0063] Figure 6 The inductor array device of the illustrated embodiment differs from figure 1The inductance device shown is that many coils 102 are formed inside the device body 101, and the configuration of the coils is the same as figure 1 The coils shown are identical and exhibit the same process and benefits.

[0064] Figure 6 The fabrication method of the shown inductance array device and figure 1 The manufacturing method of the shown inductance device is basically the same, the only difference is that it needs to be cut after lamination Figure 3A and 3B When the original she...

example 1

[0069] First, prepare figure 1 The original sheet layers used to form the insulating layer 7 of the device body 1 are shown. The preparation of the original sheet is as follows: the (NiCuZn)Fe 2 o 4 The constituent ferrite, the organic solvent consisting of toluene, and the binder consisting of polyvinyl butyral were mixed at a predetermined ratio to obtain a slurry. The slurry was coated on a PET film by the doctor blade method and dried to obtain many original sheets with a thickness of 30 μm.

[0070] Then, the original sheet was subjected to laser processing to form a predetermined pattern of 80 μm diameter through holes. Then, the original sheet layer is coated with silver paste by screen printing, and dried to form the coil pattern units 2a and 2b of predetermined repeated patterns, such as Figure 3A and 3B shown.

[0071] The coil pattern units 2a and 2b had a thickness of 10 μm after drying. like Figure 2A As shown, each coil pattern unit is actually composed...

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Abstract

An inductor device provided with a plurality of insulating layers; coil pattern units each formed between insulating layers; and connection portions for connecting upper and lower coil pattern units separated by the insulating layers to form a coil shape. The coil pattern units each have two substantially parallel linear patterns and a curved pattern connecting first ends of the linear patterns. The ratio A1 / A2, where the total of the areas of the two linear patterns seen from the plane view is Al and the area of the curved pattern seen from the plane view is A2, of 1.45 to 1.85, preferably 1.55 to 1.75. When the total area of a unit section of the insulating layer in which one coil pattern unit is contained is A0, the ratio (A1+A2) / A0 is in a range of 0.10 to 0.30, preferably 0.13 to 0.20.

Description

technical field [0001] The invention relates to an inductance device and a manufacturing method thereof. Background technique [0002] There has long been a desire in the market for electronic devices to become smaller and smaller. Therefore, devices used in electronic equipment are required to be more and more miniaturized. With the development of surface mount technology to manufacturing technology, the original electronic devices with leads have been contained in so-called "chip devices" without leads. Capacitors, inductors and other devices mainly including ceramic type devices are fabricated using thin layer processes based on thick film formation techniques or using screen printing techniques etc. and using co-firing processes of ceramics and metals. This makes it possible to realize a monolithic structure with internal conductors and further reduce its size. [0003] The following manufacturing methods are suitable for manufacturing this chip inductor device. [0...

Claims

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Application Information

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IPC IPC(8): H01F17/00H01F41/04
CPCH01F17/0013H01F41/043H01F17/00
Inventor 安保敏之内木场文男
Owner TDK CORPARATION