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Waveguide structure

A technology of waveguide structure and conductor connection, which is applied in the direction of waveguide, waveguide-type devices, radiation element structure, etc., can solve the problems of increasing circuit realization cost, energy loss, limited loss coefficient, etc., and achieve reduced energy loss and high average power The effect of capacity and low loss

Active Publication Date: 2021-12-07
SUBTRON TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the above-mentioned structure, the dielectric material covered by the upper and lower metal surfaces and copper pillars will cause energy loss during signal transmission, especially the higher the frequency, the greater the loss
Therefore, the selection of dielectric materials is often limited by the loss factor (Dissipation Factor, Df), which is easy to increase the cost of circuit implementation

Method used

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Embodiment Construction

[0059] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and description to refer to the same or like parts.

[0060] Figure 1A It is a schematic top view of a waveguide structure according to an embodiment of the present invention. Figure 1B is along Figure 1A A schematic cross-sectional view of the line A-A. Figure 1C is along Figure 1A The schematic cross-section of the line A'-A'. Please also refer to Figure 1A and Figure 1B , in this embodiment, the waveguide structure 100a includes a dielectric layer 110a, a multilayer wiring layer 120a, a multilayer insulating layer 130a and a conductor connection layer 140a. The dielectric layer 110a has an opening 112a. The circuit layer 120a is disposed on the dielectric layer 110a, and the insulating layer 130a and the circuit layer 120a are al...

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Abstract

The invention discloses a waveguide structure. The waveguide structure comprises a dielectric layer, a plurality of circuit layers, a plurality of insulating layers and a conductor connecting layer, the dielectric layer has an opening. The circuit layer is disposed on the dielectric layer. The insulating layers and the circuit layers are alternately stacked. The conductor connecting layer covers the outer wall of the opening in the direction perpendicular to the line layers and is connected with at least two line layers located on the two opposite sides of the opening. At least the conductor connecting layer and a part of the circuit layer define an air cavity for transmitting signals at the corresponding opening. The waveguide structure provided by the invention is provided with the air cavity for transmitting signals, can reduce energy loss during signal transmission, has relatively high average power capacity, and is not influenced by a dielectric material outside the air cavity.

Description

technical field [0001] The present invention relates to a semiconductor structure, and more particularly to a waveguide structure. Background technique [0002] The current substrate integrated waveguide (Substrate Integrated Waveguide, SIW) structure is often used in high-frequency circuits, where viewed in cross section, the substrate integrated waveguide is composed of a dielectric material, the upper and lower metal surfaces on the opposite surfaces of the dielectric material, and the dielectric material and Consists of copper pillars connected to upper and lower metal surfaces. However, in the above structure, the upper and lower metal surfaces and the dielectric material covered by the copper pillars will cause energy loss during signal transmission, especially the higher the frequency, the greater the loss. Therefore, the selection of the dielectric material is often limited by the loss factor (Dissipation Factor, Df), which tends to increase the circuit implementati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P3/12H01P3/18
CPCH01P3/12H01P3/18H01P3/121H01P5/028H01P1/207H01Q1/50H01P1/2088H01Q9/0457H01Q1/38
Inventor 唐震寰刘乃祯林楹凯李宗翰张昭威
Owner SUBTRON TECH