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Bonding key layout structure of 3d stacked chip

A bonding and chip technology, applied in the field of photon sensing chip design, can solve the problem of large area of ​​photon sensing chips, and achieve the effect of reducing crossover, reducing area, and easy and safe layout.

Active Publication Date: 2021-12-10
SHENZHEN ADAPS PHOTONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even with this 3D stacking technology, the resulting photonic sensing chip area is still relatively large

Method used

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  • Bonding key layout structure of 3d stacked chip
  • Bonding key layout structure of 3d stacked chip
  • Bonding key layout structure of 3d stacked chip

Examples

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Embodiment Construction

[0038] In order to better understand the technical solutions of the present application, the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings.

[0039] It should be clear that the described embodiments are only some of the embodiments of the present application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0040] Terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of this application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0041] It should be understood that the te...

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Abstract

The invention discloses a bonding key layout structure of a 3d stacked chip, which comprises an SPAD chip and a logic chip which are stacked up and down. The SPAD chip comprises a plurality of SPAD units, and each SPAD unit is correspondingly provided with a plurality of first bonding keys. The logic chip comprises quenching reset circuit units with the same number as the SPAD units. The area of each quenching reset circuit unit is smaller than that of each SPAD unit. At least one second bonding key is correspondingly arranged in each quenching reset circuit unit. Each quenching reset circuit unit is electrically connected with at least one first bonding key of the corresponding SPAD unit through the at least one second bonding key. The first bonding key used for electric connection is an effective first bonding key, and the second bonding key used for electric connection is an effective second bonding key. Through the improvement of the structure, the utilization rate of the chip area of a photon sensing chip is higher, and the area of the photon sensing chip is reduced.

Description

technical field [0001] The present application relates to the technical field of photonic sensing chip design, in particular to a bond layout structure of 3D stacked chips. Background technique [0002] TOF (Time of Flight) technology is used in various electronic devices, such as mobile phones, digital cameras, automobiles, medical imaging equipment, security systems, and in applications such as augmented reality and virtual reality, belonging to the field of optical distance measurement technology in. A photonic sensing chip applying the TOF technology usually includes a photodetector array and a logic circuit. Among them, a type of photodetector that can be used in an image sensor is SPAD (Single Photon Avalanche Diode, Single Photon Avalanche Diode). The SPAD region is a photosensitive region that is configured to detect photons and signal the arrival time of the photons for ranging purposes. [0003] The size of the SPAD unit in the SPAD region is generally greater t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L23/49H01L25/16H01L31/107G01J1/44
CPCH01L24/13H01L24/45H01L25/167H01L23/49H01L31/107G01J1/44H01L2224/13H01L2224/45G01J2001/442
Inventor 朱春艳张超吕京颖
Owner SHENZHEN ADAPS PHOTONICS TECH CO LTD