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Optimized structure of 90-degree bridge circuit board and manufacturing method thereof

A technology for optimizing structure and circuit board, which is applied in the direction of printed circuit manufacturing, printed circuit assembled with electrical components, printed circuit connected with non-printed electrical components, etc., can solve problems such as stress mechanical damage and stress damage, and achieve two The effect of stress damage on sub-soldered ceramic capacitors

Pending Publication Date: 2021-12-10
贵阳顺络迅达电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the current 90° bridge structure, the solder joint pad of the enameled wire and the ceramic capacitor share the same solder joint pad, which is easy to cause stress damage and joint soldering of components during the welding process of components caused by common pads. Stress mechanical damage caused by secondary tin coating on the disk position

Method used

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  • Optimized structure of 90-degree bridge circuit board and manufacturing method thereof
  • Optimized structure of 90-degree bridge circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Embodiment 1: as Figure 1-2 As shown, an optimized structure of a 90° bridge circuit board includes a printed circuit board 1, a radio frequency magnetic powder magnetic ring 2, a ceramic capacitor 3, silicon rubber 4, enameled wire 5 and high-temperature tin 6, and the surface of the printed circuit board 1 is set There are three capacitor pads and six solder pads, and there are six conduction pads on the bottom surface, and the upper and lower conduction passes through the side via holes; the ceramic capacitor 3 is soldered to the capacitor pad with high-temperature tin 6, and the enameled wire 5 is wound on the radio frequency magnetic powder The magnetic ring 2 is bonded and fixed on the surface of the printed circuit board 1 with silicone rubber 4, and the input and output wire ends of the enameled wire 5 are welded to the solder pads of the printed circuit board 1, and the solder pads are made of high-temperature tin 6 For welding the input or output wires, there...

Embodiment 2

[0025] Embodiment 2: a kind of manufacturing method of 90 ° bridge circuit board optimized structure, this method comprises the following steps:

[0026] (1) Use steel mesh to print solder paste on the three capacitor pads of printed circuit board 1, use a placement machine to mount ceramic capacitors on the capacitor pads of printed circuit board, and use a reflow soldering machine for capacitor soldering ;The use of stencil printing can ensure the thickness and width of the solder paste, and the consistency of the amount of solder paste is better to avoid the phenomenon of capacitor tombstone during the reflow soldering process; improve production efficiency, soldering consistency and reliability; use high temperature solder paste to solve the problem of secondary reflow Open circuit of components caused by flow solder melting;

[0027] (2) First use 4 colors of twisted enameled wire 5 to wind the inductance coils L3, L4, L5, and L6 on the first radio frequency magnetic powd...

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Abstract

The invention discloses a 90-degree bridge circuit board optimized structure and a manufacturing method thereof, the 90-degree bridge circuit board optimized structure comprises a printed circuit board, a radio frequency magnetic powder magnetic ring, ceramic capacitors, silicone rubber, an enameled wire and high-temperature tin, the surface of the printed circuit board is provided with three capacitor bonding pads and six welding spot bonding pads, the bottom surface is provided with six conduction bonding pads, and vertical conduction is realized through side via holes; the ceramic capacitors are connected to the capacitor bonding pads through high-temperature tin soldering, the enameled wire is wound on the radio frequency magnetic powder magnetic ring and is bonded and fixed to the surface of the printed circuit board through silicone rubber, an input wire end and an output wire end of the enameled wire are welded to the welding point bonding pads of the printed circuit board, and the welding point bonding pads are welded to the input wire end or the output wire end through the high-temperature tin. And two welding spot welding pads are electrically connected with the capacitor welding pads at one ends of the two ceramic capacitors respectively. According to the invention, the common pad of the ceramic capacitors is changed into the independent welding spot pad, the enameled wire is directly connected with the welding spot pad, the welding spot pad is separated from the welding pad of the ceramic capacitor, and the problem of stress damage to the ceramic capacitor during secondary welding of the welding spot pad is solved.

Description

technical field [0001] The invention relates to an optimized structure of a 90° electric bridge circuit board and a manufacturing method thereof, belonging to the technical field of 90° electric bridges. Background technique [0002] With the continuous growth of the team of scientific research personnel in our country, the continuous improvement and progress of scientific research technology, and the continuous innovation of electronic technology, the miniaturization, ultra-thinning and superior performance of electronic product equipment have become the trend of the manufacturing industry. , which requires microwave magnetic devices to develop in the direction of short, small, light, thin, high electrical performance, and high reliability. In the current 90° bridge structure, the solder joint pad of the enameled wire and the ceramic capacitor share the same solder joint pad, which is easy to cause stress damage during the welding process of components caused by common pads...

Claims

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Application Information

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IPC IPC(8): H05K1/11H05K1/18H05K3/30H05K3/34
CPCH05K1/111H05K1/181H05K3/34H05K3/3494H05K3/30
Inventor 王勇肖松潘辉
Owner 贵阳顺络迅达电子有限公司