Low-dielectric and high-thermal-conductivity composite film material and preparation method thereof

A composite film, high thermal conductivity technology, applied in the direction of film/sheet adhesive, non-polymer adhesive additive, adhesive additive, etc., can solve the problem that the heat dissipation film cannot meet the requirements of insulation and low dielectric, and cannot meet the Problems such as mobile phone antenna heat dissipation requirements and low dielectric performance requirements are not met, and it is suitable for large-scale industrialization, mature coating technology, and convenient grinding.

Pending Publication Date: 2021-12-14
广东载乘新材料科技有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the first and second types of heat dissipation films in the prior art cannot meet the insulation and low dielectric requirements in 5G mobile phone applications; the third type of heat conduction film is made of a mixture of ordinary resin and insulating heat conduction powder. Meet the performance requirements of low dielectric; the thermal conductivity of the th

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Low-dielectric and high-thermal-conductivity composite film material and preparation method thereof
  • Low-dielectric and high-thermal-conductivity composite film material and preparation method thereof
  • Low-dielectric and high-thermal-conductivity composite film material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0030] Example 1

[0031] see Figure 1-2 , the present invention provides a technical solution: a composite film material with low dielectric and high thermal conductivity, comprising a resin layer 1, a ceramic composite layer 2, ceramic particles 3, pores 4 and ceramic particles 5, and the top of the resin layer 1 is laid and connected with The ceramic composite layer 2 has ceramic particles 3 distributed on one side of the ceramic composite layer 2 , pores 4 are distributed on one side of the ceramic particles 3 , and ceramic particles 5 are sheathed on one side of the pores 4 .

[0032] Preferably, the resin layer is resin, including two or more of polyimide resin, alkyl phenolic resin, xylene resin, and curable silicone resin, and the thickness of the resin layer is 10-50 μm.

[0033] Optimized, the ceramic composite layer is a uniform mixture of a resin substrate and ceramic particles, wherein the resin substrate includes two or more of polyimide resin, alkyl phenolic r...

Example Embodiment

[0069] Embodiment 2

[0070] see image 3 , a preparation method of composite film material, comprising the following steps: step 1, resin layer preparation; step 2, ceramic particle preparation; step 3, ceramic composite layer preparation; step 4, high temperature hot pressing,

[0071] In step 1, after mixing the resin raw materials, and adding ethyl acetate to the raw materials as a grinding medium, then using a grinding disperser to grind the raw materials for the first time, so that the rotation speed is 10-500 rpm, and the grinding time is 0.5- 4H, then pour the resin into the molding box, and then use the scraper to coat the resin, so that the dry film thickness is 20 ~ 80μm, and finally the dry film is placed in the tunnel drying furnace, so that the drying temperature is 80 ~ 260 ℃, the drying time is 1-3H, so that the resin layer is obtained after drying;

[0072] In the second step, after the ceramic raw materials are mixed, toluene is put into the raw material as...

Example Embodiment

[0075] Embodiment 3

[0076] see Figure 4-6 , in step 3, the grinding and dispersing machine includes a dispersing machine main body 01, a supporting frame 02 and a quantitative feeding assembly 03, the top outer wall of the dispersing machine main body 01 is welded and fixed with a supporting frame 02, and one side inner wall of the supporting frame 02 is fixed with a quantitative feeding Feed assembly 03;

[0077] Quantitative feeding assembly 03 includes moving groove 031, chute 032, air cylinder 033, limit plate 034, support plate 035, aggregate funnel 036, quantitative cup 037, slider 038, rotating plate 039 and baffle 0310, support frame 02 There is a moving groove 031 on the inner wall of one side, a quantitative cup 037 is installed on one side of the moving groove 031, a slider 038 is symmetrically welded and fixed on the outer wall of one side of the quantitative cup 037, and the inner walls on both sides of the moving groove 031 are correspondingly sliding Each blo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Particle sizeaaaaaaaaaa
The average particle sizeaaaaaaaaaa
The average particle sizeaaaaaaaaaa
Login to view more

Abstract

The invention discloses a low-dielectric and high-thermal-conductivity composite film material and a preparation method thereof. The composite film material comprises a resin layer, a ceramic composite layer, ceramic particles, pores and ceramic microparticles, the ceramic composite layer is laid and connected to the upper portion of the resin layer, the ceramic particles are distributed in one side of the ceramic composite layer, the pores are distributed in one side of the ceramic particles, and the ceramic particles are sleeved in one side of the pores; the resin layer is resin and comprises two or more of polyimide resin, alkyl phenolic resin, xylene resin and curable organic silicon resin; the ceramic composite layer is formed by uniformly mixing a resin base material and ceramic particles, wherein the resin base material comprises two or more of polyimide resin, alkyl phenolic resin, xylene resin and curable organic silicon resin; and the composite film material has the low dielectric property and the high heat dissipation property at the same time, and the problem that the signal transmission speed of antenna products is reduced due to current leakage caused by the high dielectric constant of a conventional heat dissipation film can be solved.

Description

technical field [0001] The invention belongs to the technical field of composite materials, in particular to a composite film material with low dielectric and high thermal conductivity and a preparation method thereof. Background technique [0002] Most of the existing heat dissipation films on the market fall into the following three categories: the first category is metal heat dissipation, specifically including heat dissipation copper foil, heat dissipation aluminum foil, etc.; the second category is graphite, specifically including natural graphite sheets, artificial graphite sheets, graphene film, etc.; the third category is insulation and heat dissipation, which specifically includes ordinary heat-conducting film (composed of epoxy resin and insulating heat-conducting powder), heat-conducting silica gel sheet, aluminum nitride, boron nitride ceramics and other composite materials; however, with the development of 5G mobile phones With the arrival of mobile phone antenn...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C09J7/30C09J7/25C09J183/04C09J179/08C09J11/04
CPCC09J7/30C09J7/25C09J183/04C09J179/08C09J11/04C08K2003/282C08K2003/385C09J2301/124C09J2301/408C09J2479/086C09J2483/006C09J2203/326C08L79/08C08K3/28C08K3/38C08K3/34C08L83/04
Inventor 王雷刘超仝奇昆
Owner 广东载乘新材料科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap