Supercharge Your Innovation With Domain-Expert AI Agents!

Novel indirect air cooling method and device

An air-cooling device and air-cooling technology, applied in the direction of instruments, electrical digital data processing, and digital data processing components, etc., can solve problems such as dust short circuit, increased dust volume of servers, and affecting reliability, so as to improve heat absorption and improve Sealed heat dissipation effect, the effect of improving efficiency

Pending Publication Date: 2021-12-14
苏州海企云科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The current air-cooling method is to directly blow the cooling air to the object to be cooled. For example, the CPU cooling of the server is to use the fan to continuously blow the dust-laden cold air to the CPU to take away the heat, and at the same time leave some dust on the CPU and the CPU. The amount of dust on the motherboard increases with time. This direct air cooling method will increase the amount of dust in the server, and the dust will cause a short circuit and directly affect reliability.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Novel indirect air cooling method and device
  • Novel indirect air cooling method and device
  • Novel indirect air cooling method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0041] The "dust-free server" is manufactured with indirect air-cooling technology. The server core configuration: 8-core CPU, 16G memory, 2T hard disk, and a total power of 300W are the same as the air-cooled server core configuration.

[0042] The server case is changed to a sealed case, and various interfaces are retained. The sealing degree is in accordance with the IP54 standard, that is, dustproof of level 5 and waterproof of level 4. The chassis material is 1.5mm iron plate, with heat-absorbing inner coating and heat-dissipating outer coating, the surface heat dissipation coefficient is close to 30W / (m²℃), the chassis specification is 2U, and the total area of ​​the chassis is 0.73 square meters. Fans are used outside the chassis to dissipate heat, and the wind speed on the upper and lower surfaces of the server is maintained at 2.5 m / s.

[0043]Third-party test results: When the CPU is running at 99% power, the ambient temperature is 36°C, and the air temperature insid...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a novel indirect air cooling method and device. The novel indirect air cooling method comprises indirect air cooling and a sealed case used for installing machine core components, the indirect air cooling comprises inner air cooling and outer air cooling, and the inner air cooling is used for absorbing heat of the machine core components and transmitting the heat to the surface of an outer shell of the sealed case. By means of an indirect air cooling mode, dust-free heat dissipation can be conducted on machine core components, heat in the space where internal air is located is diffused and transmitted through internal air cooling and the sealed machine case, then heat on the surface of a shell of the sealed machine case is dissipated through external air cooling, and therefore the sealed machine case can be cooled without air exchange. Meanwhile, dust is prevented from being accumulated on the surfaces of the movement components, and normal operation of the microelectronic movement is guaranteed.

Description

technical field [0001] The invention relates to the technical field of cooling, in particular to a novel indirect air cooling method and device thereof. Background technique [0002] The current air-cooling method is to directly blow the cooling air to the object to be cooled. For example, the CPU cooling of the server is to use the fan to continuously blow the dust-laden cold air to the CPU to take away the heat, and at the same time leave some dust on the CPU and the CPU. The amount of dust on the motherboard increases with time. This direct air cooling method will increase the amount of dust in the server, and the dust will cause a short circuit and directly affect reliability. [0003] In order to solve the above problems, we proposed a new indirect air cooling method and its device, which can conduct the heat inside the core components through heat transfer, and maintain the internal heat of the core components by using indirect air cooling Balance, in order to achieve...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/20G06F1/181
Inventor 陈庆洪倪骅陈东东
Owner 苏州海企云科技有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com