Novel indirect air cooling method and device

An air-cooling device and air-cooling technology, applied in the direction of instruments, electrical digital data processing, and digital data processing components, etc., can solve problems such as dust short circuit, increased dust volume of servers, and affecting reliability, so as to improve heat absorption and improve Sealed heat dissipation effect, the effect of improving efficiency

Pending Publication Date: 2021-12-14
苏州海企云科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The current air-cooling method is to directly blow the cooling air to the object to be cooled. For example, the CPU cooling of the server is to use the fan to continuously blow the dust-laden cold air to the CPU to take away the heat, and at the same

Method used

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  • Novel indirect air cooling method and device
  • Novel indirect air cooling method and device
  • Novel indirect air cooling method and device

Examples

Experimental program
Comparison scheme
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Example Embodiment

[0040] Embodiment:

[0041] Manufacturing "dust-free servers" with indirect air cooling technology, server movement configuration: 8 core CPU, 16G memory, 2T hard disk, total power 300W, the same as the air-cooled server movement configuration.

[0042] Change the server chassis to a sealing chassis, retain a variety of interfaces, and the degree of sealing is based on the IP54 standard, ie 5 dustproof, 4-level waterproof. The chassis material is 1.5mm iron plate, adding the heat intracence coating and heat dissipation outer coating, the surface heat dissipation coefficient is close to 30 W / (m2 ° C), the chassis specification is 2U, the total area of ​​the chassis is 0.73 square meters. Fan cooling outside the chassis, keeps the servers 2.5 m / sec on the upper surface of the server.

[0043]Third-party test results: At the time of CPU99% power operation, the ambient temperature is 36 ° C, and the temperature in the chassis is 49.2 ° C. (Less than 50 ° C).

[0044] Check the inn...

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Abstract

The invention provides a novel indirect air cooling method and device. The novel indirect air cooling method comprises indirect air cooling and a sealed case used for installing machine core components, the indirect air cooling comprises inner air cooling and outer air cooling, and the inner air cooling is used for absorbing heat of the machine core components and transmitting the heat to the surface of an outer shell of the sealed case. By means of an indirect air cooling mode, dust-free heat dissipation can be conducted on machine core components, heat in the space where internal air is located is diffused and transmitted through internal air cooling and the sealed machine case, then heat on the surface of a shell of the sealed machine case is dissipated through external air cooling, and therefore the sealed machine case can be cooled without air exchange. Meanwhile, dust is prevented from being accumulated on the surfaces of the movement components, and normal operation of the microelectronic movement is guaranteed.

Description

technical field [0001] The invention relates to the technical field of cooling, in particular to a novel indirect air cooling method and device thereof. Background technique [0002] The current air-cooling method is to directly blow the cooling air to the object to be cooled. For example, the CPU cooling of the server is to use the fan to continuously blow the dust-laden cold air to the CPU to take away the heat, and at the same time leave some dust on the CPU and the CPU. The amount of dust on the motherboard increases with time. This direct air cooling method will increase the amount of dust in the server, and the dust will cause a short circuit and directly affect reliability. [0003] In order to solve the above problems, we proposed a new indirect air cooling method and its device, which can conduct the heat inside the core components through heat transfer, and maintain the internal heat of the core components by using indirect air cooling Balance, in order to achieve...

Claims

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Application Information

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IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/20G06F1/181
Inventor 陈庆洪倪骅陈东东
Owner 苏州海企云科技有限公司
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