Novel indirect air cooling method and device

An air-cooling device and air-cooling technology, applied in the direction of instruments, electrical digital data processing, and digital data processing components, etc., can solve problems such as dust short circuit, increased dust volume of servers, and affecting reliability, so as to improve heat absorption and improve Sealed heat dissipation effect, the effect of improving efficiency

Pending Publication Date: 2021-12-14
苏州海企云科技有限公司
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AI-Extracted Technical Summary

Problems solved by technology

[0002] The current air-cooling method is to directly blow the cooling air to the object to be cooled. For example, the CPU cooling of the server is to use the fan to continuously blow the dust-laden cold air to the CPU to take away the heat, and at the same...
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Method used

Heat-absorbing layer 711 adopts heat-absorbing film coating design, is used to improve the heat-absorbing effect of lamination 71, and hollow portion 712 communicates with the space between inner casing 3 and laminated plate 7, is used for heat transfer to The surface of the inner casing 3.
Lamination 71 is evenly distributed on the surface of lamination 7, and the outer surface of lamination 71 is provided with heat-absorbing layer 711, for improving the effect of lamination 71 heat absorption, the inside of lamination 71 is provided with hollow portion 712, Used to transfer heat to the surface of the inner casing 3.
Please refer to Fig. 2-Fig. 7, a kind of novel indirect air-cooling device, comprises outer chassis 1, outer air-cooling device 2 and core 6, the inside of outer chassis 1 is provided with inner casing 3, is used for machine The core 6 is sealed, and the core 6 is located inside the inner casing 3. The surface of the inner casing 3 adopts a special-shaped curved surface design, which is used to increase the area for heat dissipation on the surface of the inner casing 3. The inner casing 3 includes a windward side plate 31, a windward The side plate 32, the top plate 33, and the windward side plate 31 adopt a V-shaped structure design, which is conducive to the flow of wind inside the outer case 1. The side surface of the outer case 1 is provided with an air inlet 4, and the surface of the outer case 1 is provided with an ai...
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Abstract

The invention provides a novel indirect air cooling method and device. The novel indirect air cooling method comprises indirect air cooling and a sealed case used for installing machine core components, the indirect air cooling comprises inner air cooling and outer air cooling, and the inner air cooling is used for absorbing heat of the machine core components and transmitting the heat to the surface of an outer shell of the sealed case. By means of an indirect air cooling mode, dust-free heat dissipation can be conducted on machine core components, heat in the space where internal air is located is diffused and transmitted through internal air cooling and the sealed machine case, then heat on the surface of a shell of the sealed machine case is dissipated through external air cooling, and therefore the sealed machine case can be cooled without air exchange. Meanwhile, dust is prevented from being accumulated on the surfaces of the movement components, and normal operation of the microelectronic movement is guaranteed.

Application Domain

Technology Topic

EngineeringAir exchange +2

Image

  • Novel indirect air cooling method and device
  • Novel indirect air cooling method and device
  • Novel indirect air cooling method and device

Examples

  • Experimental program(1)

Example Embodiment

[0040] Embodiment:
[0041] Manufacturing "dust-free servers" with indirect air cooling technology, server movement configuration: 8 core CPU, 16G memory, 2T hard disk, total power 300W, the same as the air-cooled server movement configuration.
[0042] Change the server chassis to a sealing chassis, retain a variety of interfaces, and the degree of sealing is based on the IP54 standard, ie 5 dustproof, 4-level waterproof. The chassis material is 1.5mm iron plate, adding the heat intracence coating and heat dissipation outer coating, the surface heat dissipation coefficient is close to 30 W / (m2 ° C), the chassis specification is 2U, the total area of ​​the chassis is 0.73 square meters. Fan cooling outside the chassis, keeps the servers 2.5 m / sec on the upper surface of the server.
[0043]Third-party test results: At the time of CPU99% power operation, the ambient temperature is 36 ° C, and the temperature in the chassis is 49.2 ° C. (Less than 50 ° C).
[0044] Check the inner temperature of the sealing chassis: t = 300 / 0.73 / 30 + 36 = 49.70 (° C)
[0045] It is very close to the measured 49.2 ° C, so it is known that the heat dissipation effect of the chassis is in line with the requirements.
[0046] Since the sealing chassis is in a sealed state, the number of dust from the dust is accumulated in the number of dust: D = C + HNFT,
[0047] Medium D: Diamese, C: The number of initial dust during the package, H: the dust air dust, N: the dust in the dust, the amount of dust falling on the motherboard, f: air volume, liter / minute , T: into the wind time;
[0048] It is known that the dust-shaped air dust H is 0, and the number of dust inside the sealing chassis can always be the number of initial dust at the time of the package, so the amount of dust inside the sealing chassis is not in the case of the heat dissipation effect of the sealing chassis. Increase.
[0049] When used, the core 6 is sealed in the inside of the inner casing 3 by the inner casing 3, and the core 6 is activated, and the inner casing 3 is activated. The wind is in a state of circulating flow. The flow of the wind will move along the heat generated when the movement is operated, and the flow of the inner wind inner casing 3 is in contact with the surface of the laminated sheet 71, so that the movement 6 can be generated The heat is constantly transported to the surface of the laminated sheet 71, and heat is absorbed by the heat absorbing layer 711 on the surface of the lamination 71.
[0050] The heat absorbed by the laminated sheet 71 will be transmitted inwardly, and in the hollow portion 712, the overlay portion 712 is entered between the inner housing 3 and the laminated plate 7, and is introduced to the surface of the inner housing 3, and then inward The shaped curved surface of the housing 3 is introduced into the heat dissipation layer 321, driving the outer air cooling device 2 by the related drive device, the outer air cooling device 2 will move the wind flow from the air outlet 4 into the outer chassis 1, and from The position of the air inlet 5 flows out, and the wind flow is passed from the surface of the inner case 3 when entering the outer chassis 1.
[0051] When the wind flows through the inner casing 3, the heat of the heat radiating layer 321 is taken away, and the core 6 generated by the core 6 is constantly being transferred to the outside of the inner housing 3 when the core 6 is operated. The heat inside the inner casing 3 remains at a certain range, does not affect the operation of the movement 6, during which the inner casing 3 is always in a sealing state, so the dust inside the inner casing 3 will not Increase to ensure the normal operation of the movement 6.
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Description & Claims & Application Information

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the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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