Novel indirect air cooling method and device
An air-cooling device and air-cooling technology, applied in the direction of instruments, electrical digital data processing, and digital data processing components, etc., can solve problems such as dust short circuit, increased dust volume of servers, and affecting reliability, so as to improve heat absorption and improve Sealed heat dissipation effect, the effect of improving efficiency
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[0040] Embodiment:
[0041] Manufacturing "dust-free servers" with indirect air cooling technology, server movement configuration: 8 core CPU, 16G memory, 2T hard disk, total power 300W, the same as the air-cooled server movement configuration.
[0042] Change the server chassis to a sealing chassis, retain a variety of interfaces, and the degree of sealing is based on the IP54 standard, ie 5 dustproof, 4-level waterproof. The chassis material is 1.5mm iron plate, adding the heat intracence coating and heat dissipation outer coating, the surface heat dissipation coefficient is close to 30 W / (m2 ° C), the chassis specification is 2U, the total area of the chassis is 0.73 square meters. Fan cooling outside the chassis, keeps the servers 2.5 m / sec on the upper surface of the server.
[0043]Third-party test results: At the time of CPU99% power operation, the ambient temperature is 36 ° C, and the temperature in the chassis is 49.2 ° C. (Less than 50 ° C).
[0044] Check the inn...
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