Substrate rotary processing equipment and method

Abstract

The invention discloses rotary substrate processing equipment and method. The equipment comprises: a rotating table and multiple sets of clamping mechanisms, wherein each set of clamping mechanism comprises a chuck pin capable of relatively sliding in the radial direction of the rotating table, a sensor fixedly arranged on the chuck pin, and a driving assembly used for driving the chuck pin to move; and a processor in electrical connection or signal connection with the sensor and the driving assembly. The method comprises the following steps that (1) a substrate is placed on a rotating table; (2) a driving assembly drives a chuck pin to slide inwards, and a sensor abuts against the substrate; and (3) the rotating table drives the substrate to rotate, the sensor detects the pressure in real time and sends out a detection signal F, and a processor analyzes to obtain an analysis result and then controls the driving assembly to drive the chuck pin to move. According to the invention, the clamping pressure can be adjusted in real time, the substrate is well protected against damage in the rotating treatment process, the product yield is increased, and the production safety is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a substrate rotary processing device and method. Background technique [0002] In the process of manufacturing semiconductor products, multiple processes such as photolithography, film deposition, etching, bonding, polishing, etc. are involved. These processes will generate impurity particles and contaminate the substrate. If the impurity particles are not removed in time Just enter the next process, which will cause the substrate to fail. At present, chemical or physical methods are usually used to remove impurity particles from the substrate. Among them, in the chemical method, a rotating device is used to relatively fix the substrate to be cleaned, and then the substrate is driven to rotate at a high speed, and at the same time, chemical liquid is sprayed on the surface of the substrate through a nozzle to remove surface impurities. The method can also be ap...

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Problems solved by technology

[0004] However, the existing chuck pins have the following problems: the chuck pins can only perform an initial position adjustment when the substrate has just been placed on the rotating device and have not started to rotate, so that the substrate can be clamped with an appropriate clamping force; but in practice In general, the rotating device rotates at high speed during operation, which generates a large centrifugal force, and the substrate tends to move radially outward, and is easy to shift, resulting in high pressure at the contact point between the substrate and the chuck pin, which may It will exceed the ultimate bearing capacity of the substrate material, resulting in damage to the substrate, a drop in yield, and even debris, causing safety accidents

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