Methods of forming microelectronic devices, and related microelectronic devices and electronic systems

Abstract

The invention relates to methods of forming microelectronic devices, and related microelectronic devices and electronic systems. The method of forming a microelectronic device comprises forming a microelectronic device structure comprising a base structure, a doped semiconductive structure comprising a first portion overlying the base structure and second portions vertically extending from the first portion and into the base structure, a stack structure overlying the doped semiconductive structure, cell pillar structures vertically extending through the stack structure and to the doped semiconductive structure, and digit line structures vertically overlying the stack structure. An additional microelectronic device structure comprising control logic devices is formed. The microelectronic device structure is attached to the additional microelectronic device structure to form a microelectronic device structure assembly. The carrier structure and the second portions of the doped semiconductive structure are removed. The first portion of the doped semiconductive structure is then patterned to form at least one source structure coupled to the cell pillar structures. Devices and systems are also described.

Description

[0001] Cross References to Related Applications [0002] This application claims that the serial number of the application titled "METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTRONIC DEVICES AND ELECTRONIC SYSTEMS" filed on June 18, 2020 is 16 / 905,747 US patent application relating to a titled "Microelectronics" filed June 18, 2020 listing Kunal R. Parekh as inventor US Patent Application Serial No. 16 / 905,385 for Electronic Devices and Related Methods, Memory Devices, and Electronic Systems (MICROELECTRONIC DEVICES, AND RELATED METHODS, MEMORY DEVICES, AND ELECTRONIC SYSTEMS). This application is also related to the application titled "Methods of Forming Microelectronic Devices and Related Microelectronic Devices, Memory Devices, Electronic Systems, and Additional Methods," filed on June 18, 2020, listing Kunal R. Parekh as the inventor. (METHODS OF FORMING MICROELECTRONIC DEVICES, ANDRELATED MICROELECTRONIC DEVICES, MEMORY DEVICES, ELECTRONIC SYSTEMS, AN...

AI Technical Summary

Problems solved by technology

However, the processing conditions (e.g., temperature, pressure, materials) used to form memory arrays above the substrate control logic structure can limit the configuration and performance of control logic devices within the substrate control logic structure

In addition, the number, size, and arrangement of different control logic devices employed within the base control logic structure can also undesirably prevent memory device size (e.g., horizontal footprint) reduction and / or memory device performance improvements (e.g., faster memory cell turn-on / turn-off speed, lower threshold switching voltage requirements, faster data transfer rates, lower power consumption)

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