Three-dimensional variable cross-section turbulent flow column structure, heat exchange plate and heat exchanger core

Abstract

The invention discloses a three-dimensional variable cross-section turbulent flow column structure, a heat exchange plate and a heat exchanger core. The turbulent flow column comprises a low-temperature turbulent flow column and a high-temperature turbulent flow column. The low-temperature turbulent flow column is formed by connecting an oval bottom surface and an oval top surface through a concave side wall, and the high-temperature turbulent flow column is formed by connecting an oval bottom surface and an oval top surface through a concave side wall. A plurality of three-dimensional variable cross-section turbulent flow column structures which are arranged in an array type row and column mode are formed in the heat exchange plate through the photoelectrochemical etching technology, so that the heat exchange effect of a channel is enhanced. When fluid passes through the three-dimensional variable cross-section turbulent flow columns in the heat exchange plate, not only are the turbulence level and the secondary vortex of the fluid enhanced to achieve the effect of enhancing heat exchange, but also the pressure loss caused by the traditional uniform cross-section turbulent flow columns is greatly reduced due to the existence of the three-dimensional variable cross-section turbulent flow columns, and therefore, the carbon dioxide has better heat exchange performance in the printed circuit board type heat exchanger.

Description

technical field [0001] The invention belongs to the field of enhanced heat exchange, and specifically relates to a three-dimensional variable cross-section spoiler column structure, a heat exchange plate and a heat exchanger core. Background technique [0002] Printed Circuit Heat Exchanger (PCHE), as a new type of compact heat exchanger, is widely used in the heat exchange equipment of ultra-high temperature reactors. Its working principle is to transfer heat from one medium to another. a medium. The core of the printed circuit board heat exchanger is composed of several high-temperature medium heat exchange plates and several low-temperature medium heat exchange plates. When the heat transfer capacity is increased or the pressure drop loss is reduced, the overall heat transfer performance of the heat exchanger will be improved. . [0003] Due to the low viscosity and high thermal conductivity of supercritical carbon dioxide, it has low compression work and has been widel...

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Problems solved by technology

However, the improvement of the spoiler structure is mostly three-dimensional constant cross-section optimization, and the cross-sectional shape in the height direction is consistent, so it is greatly affected by the impact of incoming flow in terms of drag reduction.

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