Surface acoustic wave filter packaging method and packaging structure
A surface acoustic filter and packaging method technology, applied in the direction of electrical components, impedance networks, etc., can solve problems such as cover film collapse, chip functional area impact, etc., and achieve the effect of reducing thickness, weight and occupied space
Active Publication Date: 2021-12-28
深圳新声半导体有限公司
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[0044]The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
[0045] The embodiment of the present invention proposes a surface acoustic filter packaging method, such as figure 1 As shown, the surface acoustic filter packaging method includes:
[0046] Step 1, respectively setting the wafer main body and the auxiliary components with the wafer main body as the core on the first base body and the second base body;
[0047] Step 2, laying an isolation insulating layer above the wafer body, and marking the position of the IDT functional area above the isolation insulating layer;
[0048] Step 3, making an opening in the isolation insulating layer corresponding to the position of the IDT functional area to expose the IDT functiona...
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Abstract
The invention provides a surface acoustic wave filter packaging method and packaging structure. The surface acoustic wave filter packaging structure comprises a first glass cover plate, a second glass cover plate, an IDT functional area packaging part, a wafer main body and a wafer main body carrier; an insulating layer is arranged on the upper surface of the wafer main body, and an opening is formed in the position, right opposite to the IDT function area, of the insulating layer, so that the IDT function area is exposed; the IDT function area and the packaging part are arranged on the IDT function area; the first glass cover plate is buckled on the periphery of the wafer main body; the first glass cover plate is provided with a main body installation position corresponding to the position of the wafer main body. An adhesive layer is arranged on the first glass cover plate, the second glass cover plate is arranged above the IDT functional area packaging component in a buckling mode, and the first glass cover plate and the second glass cover plate are bonded through the adhesive layer; the second glass cover plate is provided with a groove corresponding to the position of the IDT function area.
Description
technical field [0001] The invention provides a packaging method and a packaging structure of a surface acoustic filter, belonging to the technical field of packaging. Background technique [0002] At present, the main packaging technologies of surface acoustic filters include metal packaging, plastic packaging, surface mount, flip-chip welding and other substrate packaging or the use of device surface film packaging. The existing packaging structure of this type of filter has the following disadvantages: the film-covered package on the surface of the device is sensitive to the size of the cavity, and it is easy to cause the film to collapse when the cavity size is large, affecting the functional area of the chip. Contents of the invention [0003] The present invention provides a surface acoustic filter packaging method and packaging structure, which are used to solve the problem that the existing surface acoustic filter packaging structure has an impact on the function...
Claims
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Login to View More IPC IPC(8): H03H9/10H03H9/64H03H3/02
CPCH03H9/1064H03H9/64H03H3/02
Inventor 袁婷魏彬
Owner 深圳新声半导体有限公司