Welding-wire-free 360-degree light-emitting diode and packaging method thereof

A technology of light-emitting diodes and no welding wire, applied in the field of diodes, can solve the problems of only 180° light-emitting angle, limited light-emitting angle, etc., and achieve the effect of improving the scope of application and simple preparation

Pending Publication Date: 2021-12-31
广西永裕半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The LED package of the prior art includes a BT-pcb board, a solid crystal part, a bonding wire part, insulating glue, a first bonding wire, a second bonding wire, epoxy resin or s

Method used

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  • Welding-wire-free 360-degree light-emitting diode and packaging method thereof
  • Welding-wire-free 360-degree light-emitting diode and packaging method thereof
  • Welding-wire-free 360-degree light-emitting diode and packaging method thereof

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Embodiment Construction

[0021] The technical solution in the present invention will be clearly and completely described below in conjunction with the accompanying drawings. The preferred embodiment in the description is only used as an example, and all other embodiments obtained by those skilled in the art without making creative work, All belong to the protection scope of the present invention.

[0022] Such as Figure 1-Figure 3 As shown, the wire-free 360° light-emitting diode described in this specific embodiment includes: PCB board, molding colloid 5, flip-chip LED chip 6, chip electrode 7 and conductive substance 8; several flip-chip LED chips 6 set in the molding colloid 5;

[0023] The PCB board includes No. 1 crystal-bonding base plate 1, No. 2 crystal-bonding base plate 2, No. 1 chip pad 3 and No. 2 chip pad 4; the No. 1 chip pad 3 and No. 2 chip pad The inner side of the disc 4 is respectively fixed with a No. 1 crystal-bonding base plate 1 and a No. 2 crystal-bonding base plate 2; the u...

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Abstract

The invention discloses a welding-wire-free 360-degree light-emitting diode and a packaging method thereof, and relates to the technical field of diodes. A PCB comprises a first die bonding bottom plate, a second die bonding bottom plate, a first patch bonding pad and a second patch bonding pad; a first die bonding bottom plate and a second die bonding bottom plate are fixed to the inner side of the first patch bonding pad and the inner side of the second patch bonding pad respectively; upper parts of the first die bonding bottom plate and the second die bonding bottom plate are connected with chip electrodes at the two ends of the plurality of flip LED chips through conductive substances; and a molded rubber body covers the first die bonding bottom plate, the second die bonding bottom plate, the conductive substance, the chip electrode and the flip LED chip. Glue guide grooves are formed in the adjacent side walls of the bottoms of the first die bonding bottom plate and the second die bonding bottom plate. The lower portion of the molded rubber body is arranged in the rubber guide groove, and the bottom edge of the molded rubber body is flush with the lower edge of the rubber guide groove. The diode is simple to prepare and has a 360-degree light-emitting angle, and the application range of the diode is widened.

Description

technical field [0001] The invention relates to the technical field of diodes, in particular to a wire-free 360° light-emitting diode and a packaging method thereof. Background technique [0002] A light-emitting diode is a solid-state semiconductor device that can directly convert electrical energy into light energy. The heart of the light-emitting diode is a semiconductor chip. One end of the chip is attached to a bracket, which is the negative pole, and the other end is connected to the positive pole of the power supply. The entire chip is encapsulated by epoxy resin. Light-emitting diode chip is made up of two parts, and a part is P-type semiconductor, and hole occupies an leading position in it, and the other end is N-type semiconductor, is mainly electron here. But time these two kinds of semiconductors couple together, between them, just form a "P-N junction". When the current acts on the chip through the wire, the electrons will be pushed to the P region, and in th...

Claims

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Application Information

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IPC IPC(8): H01L33/62H01L33/54
CPCH01L33/62H01L33/54H01L2933/005
Inventor 傅文斌张永兵辛顺平刘友辉
Owner 广西永裕半导体科技有限公司
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