Unlock instant, AI-driven research and patent intelligence for your innovation.

A kind of preparation method and application method of plugging resin after browning for HDI circuit board

A circuit board and plug hole technology, which is applied in printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of high copper scrap rate, easy deformation of the inner core board, and inconvenient control of the production process, so as to achieve stable product quality. , Improve production quality, easy to control the effect

Active Publication Date: 2022-07-12
广东科鼎新材料股份有限公司
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In these methods, the step of resin plugging is placed in front of the inner layer core board circuit making and browning process. The production process is inconvenient to control. The copper on the surface of the inner core board is easily worn away, resulting in a high scrap rate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of preparation method and application method of plugging resin after browning for HDI circuit board
  • A kind of preparation method and application method of plugging resin after browning for HDI circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The plugging resin for PCB provided in this embodiment is made of the following components in parts by weight: 40 parts of epoxy resin, 4 parts of epoxy reactive diluent, 0.4 part of dispersant, 2 parts of adhesive and silanes 0.1 part of coupling agent was placed in the reaction flask and stirred for 1 hour, 10 parts of latent epoxy curing agent, 0.7 part of leveling agent and 43 parts of inorganic filler were added, and the stirring was continued for 1 hour to obtain a uniform mixture. The mixture was ground in a three-roll mill to obtain a plugged resin paste.

Embodiment 2

[0032] The plugging resin for PCB and its preparation method provided in this embodiment are basically the same as those in the aforementioned embodiment 1, except that: 35 parts of epoxy resin, 5 parts of epoxy reactive diluent, 0.1 part of dispersant, adhesive 6 parts of silane coupling agent and 0.2 part of silane coupling agent, placed in the reaction flask and stirred for 2 hours, added 8 parts of latent epoxy curing agent, 0.6 part of leveling agent and 41 parts of inorganic filler, and continued stirring for 2 hours to obtain a uniform mixture. The mixture was ground in a three-roll mill to obtain a plugged resin paste.

Embodiment 3

[0034] The plugging resin for PCB provided in this embodiment and its preparation method are basically the same as those in the aforementioned embodiment 1, except that 50 parts of epoxy resin, 3 parts of epoxy reactive diluent, 0.2 part of dispersant, adhesive 0.1 part of silane coupling agent and 0.3 part of silane coupling agent, placed in the reaction flask and stirred for 1 h, added 6 parts of latent epoxy curing agent, 0.8 part of leveling agent and 40 parts of inorganic filler, and continued stirring for 2 h to obtain a uniform mixture. The mixture was ground in a three-roll mill to obtain a plugged resin paste.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a preparation method and an application method of a post-brown plugging resin for HDI circuit boards, comprising the following steps: weighing each component by weight: 35-50 parts of epoxy resin, latent epoxy curing 5-15 parts of agent, 40-50 parts of inorganic filler, 0.1-0.5 part of silane coupling agent, 3-5 parts of epoxy reactive diluent, 0.5-1 part of leveling agent, 0.1-0.5 part of dispersant, adhesive 0.1-10 parts of epoxy resin; stir and mix the epoxy resin, epoxy reactive diluent, dispersant, adhesive and silane coupling agent evenly; under stirring condition, add latent epoxy curing agent; under stirring condition , adding a leveling agent and an inorganic filler; the obtained mixture is ground in a three-roll mill to obtain a plugging resin paste. The plugging resin of the invention has high impact strength, flexural modulus and thermal conductivity after curing, and has good processing performance.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a preparation method of a post-brown plugging resin for HDI circuit boards. Background technique [0002] The traditional circuit board manufacturing method for resin plug holes in the inner core board usually uses copperizing the inner core board holes, then plugs the holes with resin, then bakes the board to solidify the resin, and then grinds the inner core board surface by grinding. The excess resin is used to make the circuit of the inner core board, browned and then pressed together. In the prior art, this method is usually used for the manufacture of the circuit board for the resin plug hole of the inner core board. In these methods, the step of resin plugging is placed in front of the inner core board circuit fabrication and browning process, and the production process is not easy to control. The copper on the surface of the inner core board is...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/40C09J163/00C09J11/04C09J11/06
CPCH05K3/0094H05K3/40C09J163/00C09J11/04C09J11/06H05K2203/1438H05K2201/0959C08K3/26C08K3/30C08K3/36C08K3/22C08K5/54
Inventor 聂雪峰
Owner 广东科鼎新材料股份有限公司