Unlock instant, AI-driven research and patent intelligence for your innovation.

A production process of chip resistors loaded on ceramic substrates

A technology of ceramic substrates and chip resistors, which is applied in the direction of resistors, resistors, and resistors at the lead-out end, so as to avoid excessive tearing and complete rupture.

Active Publication Date: 2022-04-05
浙江玖维电子科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a production process of chip resistors loaded on a ceramic substrate, which can effectively avoid the heating of the chip resistor when it is powered on, and the protective layer cracks due to the different thermal expansion coefficients of the constituent materials. , and the resistance layer is cracked, resulting in the problem of chip resistor open circuit

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A production process of chip resistors loaded on ceramic substrates
  • A production process of chip resistors loaded on ceramic substrates
  • A production process of chip resistors loaded on ceramic substrates

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 1

[0070] Specific embodiment one: a kind of chip resistor production process loaded on the ceramic substrate, comprises the following steps:

[0071] a. A ceramic substrate 1 is provided. Both the upper end surface and the lower end surface of the ceramic substrate 1 are provided with a plurality of transverse folding lines and a plurality of longitudinal folding lines. The folding line and the folding block line cross each other to form a plurality of grid areas. The position of the fold line on the lower end face corresponds to the position of the fold line on the upper end face one by one. The grid area on the upper end face corresponds to the grid area on the lower end face one by one. The position of the fold line on the lower end surface corresponds to the position of the fold line on the upper end face one by one. A groove 101 is defined between every two adjacent folding lines on the upper end surface of the ceramic substrate 1 .

[0072] b. Print the silver-palladiu...

specific Embodiment 2

[0086] Specific embodiment two: on the basis of specific embodiment one, please refer to Figure 1-11 A production process of a chip resistor loaded on a ceramic substrate, comprising the following steps:

[0087] a. A ceramic substrate 1 is provided. Both the upper end surface and the lower end surface of the ceramic substrate 1 are provided with a plurality of transverse folding lines and a plurality of longitudinal folding lines. The folding line and the folding block line cross each other to form a plurality of grid areas. The position of the fold line on the lower end face corresponds to the position of the fold line on the upper end face one by one. The grid area on the upper end face corresponds to the grid area on the lower end face one by one. The position of the fold line on the lower end surface corresponds to the position of the fold line on the upper end face one by one. A groove 101 is defined between every two adjacent folding lines on the upper end surface ...

specific Embodiment 3

[0094] Specific embodiment three: On the basis of specific embodiment two, a chip resistor production process loaded on a ceramic substrate, the opening width of the groove 101 is from one front electrode 2 close to the other front electrode 2 end to the other One front electrode 2 , that is, the area between two front electrodes 2 is covered by the groove 101 . This effectively avoids the problem that the torn part of the second resistive layer 5 cannot be in contact with the first resistive layer 4 because the tearing position of the second resistive layer 5 is too close to the front electrode 2 .

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a production process of a patch resistor loaded on a ceramic substrate, which belongs to the field of electrical component manufacturing. A production process of a chip resistor loaded on a ceramic substrate, comprising the following steps: providing a ceramic substrate, the upper end surface and the lower end surface of the ceramic substrate are provided with a plurality of horizontal folding lines and a plurality of longitudinal folding lines, The strip lines and the folding block lines intersect to form a plurality of grid areas. The position of the folding line on the end surface corresponds to the position of the folding line on the upper end surface one by one. There is a groove between every two adjacent folding lines on the upper end surface of the ceramic substrate 1, which can effectively prevent the When electricity is applied to heat, due to the different thermal expansion coefficients of the constituent materials, the protective layer is cracked, and the resistance layer is cracked, resulting in the problem of chip resistor open circuit.

Description

technical field [0001] The invention belongs to the field of electrical component manufacturing, and more specifically relates to a production process of a chip resistor loaded on a ceramic substrate. Background technique [0002] Chip resistors are mainly made of materials such as substrates, resistive films, protective films, and electrodes. [0003] The existing chip resistors mainly include an alumina ceramic body, the two sides of the upper surface of the alumina ceramic body are printed with back electrodes, and the two sides of the lower surface are respectively printed with front electrodes, and the alumina ceramic between the two back electrodes The resistance body is printed on the upper surface of the body, the upper surface of the resistance body is provided with a first protection layer, the upper surface of the first protection layer is provided with a second protection layer, and side electrodes are provided on both sides of the alumina ceramic body to form a ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01C17/02H01C17/065H01C17/28H01C17/30H01C1/14H01C1/16H01C7/18
CPCH01C17/02H01C17/065H01C17/28H01C17/30H01C1/16H01C1/14H01C7/18
Inventor 张建桃李进陆建荣
Owner 浙江玖维电子科技有限公司