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Semiconductor device manufacturing method

A manufacturing method and semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as bubble rupture, open circuit, and affecting RDL contact hole technology, so as to avoid open circuit problems and improve process yield Effect

Inactive Publication Date: 2020-07-03
NINGBO SEMICON INT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In wafer-level system packaging, it is necessary to mount a die-attach film on the pad side of the device wafer, however, the following problems are encountered in the process: bubbles are formed in the open area of ​​the pad, and during the high vacuum pressure process Bubbles will burst, which affects the RDL contact hole process and may cause an open circuit

Method used

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  • Semiconductor device manufacturing method
  • Semiconductor device manufacturing method
  • Semiconductor device manufacturing method

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Embodiment Construction

[0040] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details.

[0041] It should be understood that the invention can be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity, and like reference numerals designate like elements throughout.

[0042] It will be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to" or "coupled to" another element or layer, it can be directly on, on, or "coupled to"...

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Abstract

The invention provides a method for manufacturing a semiconductor device. The method comprises the following steps of: providing a device wafer, wherein the device wafer is provided with a front surface and a back surface which are opposite to each other; forming an opening region for exposing a welding disc on the front surface of the device wafer; forming a metal filling layer in the opening region; and pasting a chip bonding film on the front surface of the device wafer to enable the chip bonding film to cover the metal filling layer. According to the semiconductor device manufacturing method, the problem of circuit open circuit caused by bubbles formed in the opening region of the welding disc in wafer level system packaging can be avoided, and the process yield is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for manufacturing a semiconductor device. Background technique [0002] With the development trend of very large scale integrated circuits, the feature size of integrated circuits continues to decrease, and people's requirements for packaging technology of integrated circuits continue to increase accordingly. Existing packaging technologies include Ball Grid Array (BGA), Chip Scale Package (CSP), Wafer Level Package (WLP), Three-dimensional Package (3D) and System Package (SiP) Wait. System packaging can combine multiple active components, passive components, MEMS, optical components and other components with different functions into one unit to form a system or subsystem that can provide multiple functions, allowing different mass IC integration. Compared with System on Chip (SoC), the system package integration is relatively simple, the design cycle and marke...

Claims

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Application Information

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IPC IPC(8): H01L21/56
CPCH01L21/561
Inventor 刘超群
Owner NINGBO SEMICON INT CORP