Printed circuit board and manufacturing method thereof
A technology for printed circuit boards and manufacturing methods, applied in the directions of printed circuits, printed circuit manufacturing, printed circuit components, etc., can solve problems such as blind vias and open circuits, avoid open circuit problems, improve pass rate and quality, and reduce plating defects. The effect of copper
Pending Publication Date: 2021-12-03
SHENNAN CIRCUITS
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0005] The invention provides a method for manufacturing a printed circuit board to solve the problem in the prior art that cracks at the bottom of blind holes easily lead to open circuits of blind holes
Method used
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Embodiment Construction
[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0021] see figure 1 , figure 1 It is a schematic flow chart of an embodiment of the method for manufacturing a printed circuit board provided by the present invention. The specific steps of the manufacturing method of the printed circuit board of the present embodiment are as follows:
[0022] S11: Obtain the plate to be processed.
[0023] The raw material of the circuit board is cut to obtain the substrate, and then the inner layer pattern transfer and et...
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Abstract
The invention discloses a printed circuit board and a manufacturing method thereof, and the method comprises the steps: obtaining a to-be-processed plate; forming at least one blind hole in the preset position of the to-be-machined plate; sputtering a first metal layer in the blind hole; performing first electroplating from the hole bottom of the blind hole to the hole opening so as to plate a second metal layer in the blind hole; and electroplating the to-be-processed plate for the second time so as to form a third metal layer on the plate surface of the to-be-processed plate and in the blind hole. Through the mode, according to the manufacturing method of the printed circuit board, the to-be-processed board is subjected to sputtering coating once and electroplating twice, so that the phenomena of poor deposition and poor electroplating in cracks at the bottoms of the blind holes are reduced to a certain extent, and the percent of pass and the quality of the printed circuit board are improved.
Description
technical field [0001] The invention is applied to the technical field of printed circuit boards, in particular to a printed circuit board and a manufacturing method thereof. Background technique [0002] HDI is the abbreviation of High Density Interconnector, which is a technology for producing printed circuit boards, while high-density interconnection (HDI) circuit boards use micro-blind buried hole technology with relatively high circuit distribution density. For circuit boards, the hole diameter is below 6mil (mil), the ring diameter of the annular ring (Hole Pad) is below 0.25mm, the contact density is above 130 dots / square, and the line width and line spacing are below 3mil. High-density interconnect (HDI) circuit boards and substrates are widely used in high-end electronic products to meet the needs of higher I / O density and smaller footprint. [0003] At present, in the production process of high-density interconnection circuit boards in the industry, after the blin...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K3/00H05K1/11
CPCH05K3/0094H05K1/11H05K2203/0723
Inventor 曹权根杨之诚缪桦
Owner SHENNAN CIRCUITS