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Split double sided wafer and reticle clamps

A fixture and electrostatic fixture technology, which can be used in the photoplate making process of the pattern surface, microlithography exposure equipment, instruments, etc., and can solve problems such as deformation of masks and/or substrates

Pending Publication Date: 2022-01-04
ASML HLDG NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Heat from absorbed EUV radiation or unwanted non-EUV radiation may cause deformation of the reticle and / or substrate

Method used

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  • Split double sided wafer and reticle clamps
  • Split double sided wafer and reticle clamps
  • Split double sided wafer and reticle clamps

Examples

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Embodiment Construction

[0046] This specification discloses one or more embodiments that incorporate the features of the invention. The disclosed embodiments are merely illustrative of the invention. The scope of the invention is not limited to the disclosed embodiments. The invention is defined by the appended claims.

[0047]Embodiments are described, and references in the specification to "one embodiment," "an embodiment," "example embodiment," etc., indicate that the described embodiments may include a particular feature, structure, or characteristic but may not necessarily every Each embodiment includes a specific feature, structure or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. In addition, when a particular feature, structure or characteristic is described in conjunction with an embodiment, it should be understood that it is within the scope of those skilled in the art to implement such feature, structure or characteristic in combination with...

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PUM

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Abstract

An electrostatic clamp and a method for fabricating the same are disclosed. The electrostatic clamp includes a first stack and a second stack, wherein the first stack is joined with the second stack. Each of the first and second stacks includes a clamp main body, one or more electrodes disposed on the clamp main body, a dielectric plate disposed on the electrodes, and a plurality of channels inside the clamp body.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to U.S. Provisional Patent Application No. 62 / 853,900, filed May 29, 2019, which is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates to an electrostatic chuck for supporting an object (eg, a reticle or substrate) in a vacuum system (eg, an extreme ultraviolet (EUV) lithography system). Background technique [0004] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually a target portion of the substrate. A lithographic apparatus may be used, for example, in the manufacture of integrated circuits (ICs). In this case, a patterning device (which is alternatively referred to as a mask or reticle) may be used to generate a circuit pattern to be formed on the individual layers of the IC. The pattern may be transferred onto a target portion (eg, a portion comprising one or several dies) on a substra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
CPCG03F7/70708G03F7/70875H01L21/6831H01L21/682H01L21/67225H01L21/6833
Inventor M·利普森E·J·蒙克曼V·A·佩雷兹-法尔肯
Owner ASML HLDG NV