Wiring board, wiring method, electric heating assembly, ceramic tile and floor heating laying method

A wiring method and a wiring board technology, which are applied to ohmic resistance heating parts, heating elements, electric heating systems, etc., can solve the problems of difficult use of heat, long time required, increased energy consumption, etc., and achieve better heating effects , Improve heat transfer efficiency and reduce energy consumption

Pending Publication Date: 2022-01-11
苏州康碳地暖科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, in the preparation process of the floor heating system, the electric heating wires are first laid out on the wiring board according to the requirements, and then the cement is poured, and then the floor tiles are laid on the cement layer. If the thickness of the cement layer is too large, it will directly lead to electric power generation. The heat emitted by the hot wire needs to be transferred to the floor tiles through the cement layer. This process not only takes a long time, but more importantly, the heat scattered into the cement layer is difficult to be utilized by the floor tiles, which increases energy consumption and seriously affects the Underfloor heating
In addition, the existing electric heating wires are arranged in a single way, and the existing wiring board can only provide a relatively simple routing method for the electric heating wires

Method used

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  • Wiring board, wiring method, electric heating assembly, ceramic tile and floor heating laying method
  • Wiring board, wiring method, electric heating assembly, ceramic tile and floor heating laying method
  • Wiring board, wiring method, electric heating assembly, ceramic tile and floor heating laying method

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Embodiment Construction

[0030] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0031] It should be noted that the terms "first" and "second" in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate ...

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Abstract

The invention discloses a wiring board, a wiring method, an electric heating assembly, a ceramic tile and a floor heating laying method which are used for laying the electric heating wires for floor heating. The wiring board comprises a body, the body is provided with a plurality of pivot parts arranged in a distributed manner, and each pivot part is provided with one or more channel parts used for clamping the electric heating wires. Each channel part is also provided with a supporting piece which is configured to support the electric heating wires, so that a preset distance is formed between the electric heating wires and the bottom of the body. According to the present invention, the supporting piece is arranged to support the electric heating wires, so that the electric heating wires can be tightly attached to the floor tiles, energy consumption is reduced in the heating process, the heat transfer efficiency is greatly improved, and the heating effect of floor heating is better.

Description

technical field [0001] The invention relates to the field of floor heating, in particular to a wiring board and a wiring method, an electric heating component, ceramic tiles, and a floor heating laying method. Background technique [0002] At present, in the preparation process of the floor heating system, the electric heating wires are first laid out on the wiring board according to the requirements, and then the cement is poured, and then the floor tiles are laid on the cement layer. If the thickness of the cement layer is too large, it will directly lead to electric power generation. The heat emitted by the hot wire needs to be transferred to the floor tiles through the cement layer. This process not only takes a long time, but more importantly, the heat scattered into the cement layer is difficult to be utilized by the floor tiles, which increases energy consumption and seriously affects the Heating condition of floor heating. In addition, the existing electric heating ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B3/06H05B3/56E04F15/02E04F15/08F24D13/02
CPCH05B3/06H05B3/56E04F15/02E04F15/08E04F15/082F24D13/024E04F2290/023F24D2200/08
Inventor 吴煜樊
Owner 苏州康碳地暖科技有限公司
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