PCB manufacturing method and PCB

Abstract

The invention discloses a PCB (Printed Circuit Board) manufacturing method and a PCB. The method comprises the following steps of: pre-processing a multi-layer circuit board; acquiring waste material area position information; according to the waste material area position information, carrying out edge milling treatment on the preprocessed multilayer circuit board so that a milling machine can cut the waste material area of the multi-layer circuit board; performing gold immersion treatment on the multilayer circuit board after the edge milling treatment; and carrying out forming processing on the multilayer circuit board after gold immersion treatment to complete manufacturing of the PCB. According to the scheme provided by the embodiment of the invention, the position information of the waste area can be obtained, and the waste area of the multilayer circuit board is cut through the milling machine, so that the multilayer circuit board without the edge of the waste area is subjected to gold immersion treatment, the PCB manufacturing method without adhesive tape coating is realized, the production efficiency is effectively improved, and the environment pollution is avoided.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a method for manufacturing a PCB board and a PCB board. Background technique [0002] The printed circuit board, that is, the PCB board, is on one, several, or dozens of insulating boards, using the printing method, coating the wires, etching the micropores, and then laminating them layer by layer to achieve Electrical interconnection between layers. Then, various chips, resistors, capacitors, inductors and other devices are installed on the PCB board, and after a certain amount of packaging, an electronic product capable of specific computing functions is completed. As mentioned above, the role of the PCB board is twofold: one is the mechanical aspect, which is to provide mechanical support for the devices on it; the other is the electrical aspect, which is to provide circuit conduction and isolation for the devices on it. [0003] At present, in the production process of P...

AI Technical Summary

Problems solved by technology

[0003] At present, in the production process of PCB board, before immersion gold treatment, it is necessary to use adhesive tape to cover the edge of the waste area of ​​PCB board, so as to reduce the consumption of gold salt in immersion gold treatment, thereby saving costs; after immersion gold treatment, also The tape needs to be removed manually, which leads to low production efficiency, and it is difficult to handle the tape, which is easy to pollute the environment; and the use of tape wrapping has the following disadvantages: it needs to purchase an additional rubber wrapping machine with a higher price, which increases production costs, and the edge of the tape remains heavy gold After using the liquid medicine, it will affect the production quality of the PCB board, and the residual liquid medicine is easy to cause environmental pollution; therefore, there is an urgent need for a PCB board manufacturing method without adhesive tape coating

Images