A printed circuit board processing method applied in 5g industrial internet

Abstract

The present invention relates to the technical field of printed circuit board processing, in particular to a method for processing printed circuit boards applied in the 5G industrial Internet, including a processing box, one side of the processing box is fixedly connected with a circulating pump box, and the circulating pump The upper surface of the box is fixedly connected with a drive motor box, the front surface of the circulation pump box is plugged with a circulation pipe one, and the circulation pipe one is fixedly connected with the front surface of the processing box, and the one part of the circulation pump box is far away from the circulation pipe one A double-way pipe is inserted inside the side, and a cleaning assembly is sleeved on the outside of the end of the double-way pipe away from the circulation pump box. Filtration treatment is carried out to improve the quality of the electroplating solution inside the equipment, and by making the electroplating solution flow inside the equipment, it can not only improve the exchange efficiency of the electroplating solution, but also improve the quality of the electroplating solution, and solve the existing poor exchange efficiency of the electroplating solution And the problem that the plating impurities are not easy to deal with.

Description

Technical field [0001] The present invention relates to the field of printing circuit board processing, and more particularly to a printed circuit board processing method for applications in 5G industrial Internet. Background technique [0002] With the development of 5G technology, the function of electronic products must rely on electronic components and electrical interconnections between electronic components. The printed circuit board is used as the main carrier of electrical interconnection between electronic components. Its development speed will inevitably limit the footsteps of 5G technology. In the process of production and processing, the printed circuit board needs to be plated with the printed circuit board. [0003] However, the existing equipment is plated with the printed circuit board, and the electroplating fluid is slowly flowing inside the device, which greatly affects the exchange of electroplating in the upper wells in the printed circuit board, which greatl...

AI Technical Summary

Problems solved by technology

[0006] By filtering the electroplating solution, the quality of the electroplating solution inside the equipment can be improved, and by making the electroplating solution flow inside the equipment, it can not only improve the exchange efficiency of the electroplating solution, but also improve the quality of the electroplating solution, and solve the existing electroplating problems. Liquid exchange efficiency is poor and electroplating impurities are not easy to deal with. As the cylindrical pin on the wire wheel rotates and contacts with the limit pin, when the cylindrical pin contacts with the limit pin, it achieves the function of reminding. In addition, through two-way air The wind inside the board blows against the surface of the printed circuit board to accelerate the separation of the electroplating solution on the surface of the printed circuit board. Using the Bernoulli principle, the electroplating solution on the surface of the printed circuit board is accelerated to drip, so as to avoid being taken out of the equipment and causing unnecessary waste , to solve the problem of plating solution attached to the printed circuit board

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