Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for machining contact pin bonding surface of sealed connector

A processing method and connector technology, which are used in the manufacture of contacts, assembly/disassembly of contacts, etc., can solve the problems of glass insulator cracks and the inability to ensure the same plane of the pin bonding surface, and achieve less cracks and product qualification rate. high effect

Inactive Publication Date: 2022-01-14
贵州航箭电子产品有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the manufacturing process of the sealed connector, the bonding surface of the pin is on the same plane, which needs to be polished by a grinder. The existing processing method generally uses a grinder after the sealed connector is melted and sealed. This processing method will be due to The stress generated by the pins during grinding causes cracks in the glass insulators; or the bonding surface of the pins is processed first and then fixed with a positioning tool and then melted and sealed. Pin bonding surfaces are in the same plane

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] First process the pins in batches, grind and process half of the pins to form the bonding surface, and then put all the pins into the holes of the sealed connector. The holes of the sealed connector are divided into two rows, and the key is processed. Insert the mating pins into the rear holes of the sealed connector, and put the unprocessed pins into the front holes of the connector. Use tooling to fix the processed pin bonding surface to ensure that all bonding surfaces are on the same plane , and then use sintered glass to fuse and seal the connector. After the fusion is completed, use a grinding machine to process the bonding surface of the unprocessed pin.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method for machining a contact pin bonding surface of a sealed connector. The method comprises the following steps of: machining contact pins in batches, polishing half of the contact pins to machine bonding surfaces on the contact pins; putting all the contact pins into row holes of the sealing connector; dividing the row holes of the sealing connector into two rows; putting the contact pins with the machined bonding surfaces into the rear row of holes of the sealing connector; installing the un-machined contact pins into the front row of holes of the connector; fixing the machined contact pin bonding surfaces by using a tool to ensure that all bonding surfaces are positioned on the same plane; sealing the connector by using sintered glass; and machining bonding surfaces on the un-machined contact pins by using a grinding machine after completing sealing. According to the sealed connector machined through the machining method, the contact pin bonding surfaces are located on the same plane, the phenomena that a glass insulator cracks are few, and the product percent of pass is high.

Description

technical field [0001] The invention belongs to the field of sealing connector manufacturing, in particular to a processing method for sealing connector pins. Background technique [0002] During the manufacturing process of the sealed connector, the bonding surface of the pin is on the same plane, which needs to be polished by a grinder. The existing processing method generally uses a grinder after the sealed connector is melted and sealed. This processing method will be due to The stress generated by the pins during grinding will cause cracks in the glass insulator; or process the pin bonding surface first and then use positioning tooling to fix it and then melt it. However, the existing positioning tooling can only fix a row of pin bonding surfaces, which cannot guarantee all The pin bonding surfaces are in the same plane. Contents of the invention [0003] The object of the present invention is to provide a method for processing the bonding surface of the pins of the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01R43/16H01R43/20
CPCH01R43/16H01R43/20
Inventor 杨小宽欧旦
Owner 贵州航箭电子产品有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com