Method for machining contact pin bonding surface of sealed connector

Abstract

The invention provides a method for machining a contact pin bonding surface of a sealed connector. The method comprises the following steps of: machining contact pins in batches, polishing half of the contact pins to machine bonding surfaces on the contact pins; putting all the contact pins into row holes of the sealing connector; dividing the row holes of the sealing connector into two rows; putting the contact pins with the machined bonding surfaces into the rear row of holes of the sealing connector; installing the un-machined contact pins into the front row of holes of the connector; fixing the machined contact pin bonding surfaces by using a tool to ensure that all bonding surfaces are positioned on the same plane; sealing the connector by using sintered glass; and machining bonding surfaces on the un-machined contact pins by using a grinding machine after completing sealing. According to the sealed connector machined through the machining method, the contact pin bonding surfaces are located on the same plane, the phenomena that a glass insulator cracks are few, and the product percent of pass is high.

Description

technical field [0001] The invention belongs to the field of sealing connector manufacturing, in particular to a processing method for sealing connector pins. Background technique [0002] During the manufacturing process of the sealed connector, the bonding surface of the pin is on the same plane, which needs to be polished by a grinder. The existing processing method generally uses a grinder after the sealed connector is melted and sealed. This processing method will be due to The stress generated by the pins during grinding will cause cracks in the glass insulator; or process the pin bonding surface first and then use positioning tooling to fix it and then melt it. However, the existing positioning tooling can only fix a row of pin bonding surfaces, which cannot guarantee all The pin bonding surfaces are in the same plane. Contents of the invention [0003] The object of the present invention is to provide a method for processing the bonding surface of the pins of the ...

AI Technical Summary

Problems solved by technology

[0002] During the manufacturing process of the sealed connector, the bonding surface of the pin is on the same plane, which needs to be polished by a grinder. The existing processing method generally uses a grinder after the sealed connector is melted and sealed. This processing method will be due to The stress generated by the pins during grinding causes cracks in the glass insulators; or the bonding surface of the pins is processed first and then fixed with a positioning tool and then melted and sealed. Pin bonding surfaces are in the same plane