Solder resist composition and printed circuit board having cured product thereof

A printed circuit board, solder resist technology, applied in the directions of printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve the problems of expansion and peeling, solder resist voids or cracks, and solder resist composition flow out, etc., and achieve cavitation. Good resistance, less voids and cracks

Pending Publication Date: 2021-07-16
TAIYO INK SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When conventional alkali-developable photoresists are used for through-hole filling applications, the photocurability of the flame retardant composition in the through-hole is not sufficient, and swelling and peeling are likely to occur during solder levelling (Solder leveller) Hereinafter referred to as "vacuole")
And, there are also problems that the uncured solder resist composition flows out from the through hole in the subsequent process, or that voids or cracks occur in the solder resist that fills the hole.

Method used

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  • Solder resist composition and printed circuit board having cured product thereof
  • Solder resist composition and printed circuit board having cured product thereof
  • Solder resist composition and printed circuit board having cured product thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6 and comparative example 1～2

[0123] Each component was blended in the compounding composition shown in Table 1 (values ​​are parts by mass), and kneaded with a 3-roll mill to prepare an alkali-soluble photocurable resin composition. In addition, (A) carboxyl group-containing resin in Table 1 is 100 weight part in conversion of solid content.

[0124] A photocurable resin composition was printed on a through-hole substrate having a plate thickness of 1.6 mm and a hole diameter of 0.25 mm by a screen printing method using a 90-mesh polyester screen formed with a pattern capable of filling through holes. Furthermore, both surfaces were coated over the entire surface with a 90-mesh polyester screen, and dried for 30 minutes with a 75° C. hot air drier.

[0125] Then, using HMW-680GW of ORC Co., Ltd., at 500J / cm 2 The exposure amount is exposed to UV curing of the coating film. Then, heat curing was performed at 80° C. for 30 minutes, 110° C. for 30 minutes, and 150° C. for 40 minutes with a hot air circulat...

Synthetic example 1

[0127] In a 2-liter separable flask equipped with a stirrer, thermometer, reflux condenser, dropping funnel, and nitrogen line, add 900 parts of diglyme as a solvent, 21.4 parts of peroxide 2 - Tert-butyl ethylhexanoate (PERBUTYL O manufactured by NOF Corporation) was heated to 90°C. After heating, 309.9 parts of methacrylic acid, 116.4 parts of methyl methacrylate, 109.8 parts of lactone-modified 2-hydroxyethyl methacrylate (PLACCEL FM1 manufactured by DAICEL CHEMICAL INDUSTRIES, LTD.) and 21.4 parts were used as polymerization initiators. Bis(4-tert-butylcyclohexyl)peroxydicarbonate (PEROYL TCP manufactured by NOF Co., Ltd.) was added dropwise thereto over a total of 3 hours, followed by aging for 6 hours to obtain a carboxyl group-containing copolymer resin. It should be noted that this reaction was carried out under a nitrogen atmosphere.

[0128] Then, 363.9 parts of 3,4-epoxycyclohexylmethyl acrylate (CYCLOMER A200 manufactured by DAICEL CHEMICAL INDUSTRIES, LTD.), 3.6 ...

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Abstract

The invention provides a solder resist composition used for filling a through hole of a printed circuit board and the printed circuit board with a cured product of the solder resist composition. The solder resist composition is characterized by containing (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a compound containing an ethylenically unsaturated group and an epoxy group, (D) an inorganic filler and (E) a thermosetting resin.

Description

technical field [0001] The present invention relates to a solder resist suitable for filling through holes of printed wiring boards, a photocurable resin composition having few voids and cracks after curing, and good void resistance, a cured product thereof, and a printed wiring board formed using the same. Background technique [0002] Currently, there has been developed a resin filler formed by alternately laminating interlayer resin insulating layers and conductive circuit layers on a printed circuit board after filling resin fillers into through holes provided in the printed circuit board and curing to smooth the surface. A multilayer printed wiring board, or a multilayer printed wiring board in which a solder resist film for protecting a circuit is directly formed on a substrate filled with a resin filler in through holes or the like (Patent Document 1). Especially recently, in order to reduce the manufacturing cost of a printed circuit board, the filling of a through-h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/027H05K3/28
CPCG03F7/004G03F7/027H05K3/287
Inventor 野口智崇工藤知哉浦国斌东海裕之吕川
Owner TAIYO INK SUZHOU
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