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Continuous vacuum heating equipment

A technology of vacuum heating and equipment, applied in lighting and heating equipment, furnace types, furnaces, etc., can solve the problems of prolonged process time and unable to improve production efficiency

Pending Publication Date: 2022-01-21
GRP UP IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When switching the heating parameters of each stage, it is necessary to wait for the temperature in the heating equipment to rise or fall, resulting in prolonged process time
The cooling process is after the multi-stage heating process, and it is necessary to wait for the temperature of this batch of circuit boards to return to room temperature in the heating equipment before taking out the circuit boards that have been baked. The multi-stage heating process starts at the same time as the cooling process of the plate, so that the non-continuous single-batch production cannot improve the production efficiency

Method used

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Embodiment Construction

[0023] refer to Figure 1 to Figure 3 , is an embodiment of the continuous vacuum heating equipment of the present invention. The continuous vacuum heating device is suitable for heat treatment of at least one circuit board 9 . The circuit board 9 can be coated with a circuit layer on one or both sides. In this embodiment, the number of the circuit boards 9 is taken as an example to express that the circuit boards 9 can be heated in batches. However, the number of the circuit boards 9 may also be only one, and is not limited to a specific number. The continuous vacuum heating equipment includes a feed cabin 1 , a vacuum heating cabin 2 , a discharge cabin 3 , a conveying system 4 , a feed temporary storage area 5 and a discharge temporary storage area 6 .

[0024] The feed compartment 1 is suitable for the circuit board 9 to be moved into it from the outside, and the internal pressure value can be controlled and adjusted. The vacuum heating cabin 2 communicates with the fe...

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Abstract

The invention discloses continuous vacuum heating equipment which is suitable for performing heat treatment on a circuit board. The continuous vacuum heating equipment comprises a feeding cabin, a vacuum heating cabin and a discharging cabin. The vacuum heating cabin comprises at least two heating sections with different temperatures. The feeding cabin allows the circuit board to move in from the outside under ambient pressure, and allows the circuit board to be transferred to the vacuum heating cabin under vacuum pressure. The vacuum heating cabin is used for sequentially carrying out heat treatment on the circuit board at the heating section under vacuum pressure. The discharging cabin is used for enabling the circuit board to move in from the vacuum heating cabin under vacuum pressure, and enabling the circuit board to move out to the outside under ambient pressure. Through the heating sections which are different in temperature and enable the circuit board to be subjected to heat treatment in a reciprocating mode, the purposes of shortening the heat treatment process time of the circuit board and achieving continuous multi-batch production can be achieved.

Description

technical field [0001] The invention relates to a vacuum heating device, in particular to a continuous vacuum heating device suitable for heat treatment of circuit boards. Background technique [0002] With the advent of the 5G era, in order to meet the needs of electronic communication products with larger and faster computing and processing capabilities, the diameter of the circuit pattern made of metal wires on the motherboard of electronic communication products must be reduced. The requirement for the conduction rate per unit area also increases accordingly. However, during the heating process of the heat treatment process of the existing circuit board, the conduction rate per unit area of ​​the metal wire is reduced due to the oxidation reaction of the metal wire with oxygen at high temperature. In addition, the existing heat treatment process of the circuit board includes a multi-stage heating process and a cooling process. The multi-stage heating process is to put ...

Claims

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Application Information

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IPC IPC(8): F27B9/04F27B9/22F27B9/30F27B9/38F27B9/36H05K3/00
CPCF27B9/042F27B9/22F27B9/30F27B9/38F27B9/36H05K3/00F27B2009/382
Inventor 陈安顺
Owner GRP UP IND CO LTD
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