An etching device for producing integrated circuit lead frames

Abstract

The invention relates to the technical field of etching, in particular to an etching device for producing integrated circuit lead frames, comprising a support seat, an etching pool is fixedly installed on the top of the support seat, and the etching pool is used to store etching liquid for etching , the top of the etching pool is provided with a plurality of casings, and the tops of the plurality of casings are jointly provided with a horizontal transmission mechanism, and the horizontal transmission mechanism is used to drive the casing to perform horizontal transmission. The bottom of the casing is passed through an elastic support mechanism There are two etched plates fixedly connected; when the horizontal transmission mechanism drives multiple pairs of housings to move from left to right, and under the combined action of the guiding mechanism and the elastic support mechanism, the lead frame is clamped by the two etched plates, and the guide The mechanism brings each pair of etching boards holding the lead frame into the etching pool where the etching solution is placed, and the etching solution will diffuse into the etching holes to etch the places that need to be etched.

Description

Technical field [0001] The present invention relates to the field of etching, in particular to an etching device for the production of an integrated circuit lead frame. Background [0002] Lead frame is the chip carrier of integrated circuit, is a kind of bonding material to achieve the internal circuit lead end of the core and the electrical connection of the outer lead, the formation of the key structural parts of the electrical circuit, when using the lead frame, the need to etch to remove the unwanted parts of the surface of the lead frame. [0003] Prior art discloses part of the patent document on etching, the application number is 201920941748. X's Chinese patent, disclosing a patent for etching equipment for the lead frame assembly line, including an etching pool and a bracket, the bracket is located on the side of the etching pool, the upper end of the bracket is provided with a guide rail, the guide rail is set along the length of the etching pool and its length is gre...

AI Technical Summary

Problems solved by technology

[0004] The lead frame is usually etched with an etching box for auxiliary etching. The lead frame to be etched is placed in the etching box, and then the etching box is sunk into the etching pool containing the etching solution. After a period of reaction, the etching box is taken out and removed from the When removing the etched lead frame from the etching box and taking out the etched etching box from the etching pool, the existing etching equipment is too simple and inconvenient to clean the etching solution on the surface of the etching box. During the removal process, the etching solution will adhere to the surface, and the etching solution attached to the surface of the etching box will drip outside the etching tank during the moving process, resulting in waste of etching solution and affecting the working environment of etching. On the other hand, due to the corrosiveness of the etching solution, it will affect the staff to take out the lead frame inside the etching box, causing harm to the staff. Therefore, we propose an etching equipment for producing integrated circuit lead frames

Images