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Cooling system and control method thereof

A cooling system control and cooling system technology, applied in semiconductor/solid-state device manufacturing, discharge tubes, electrical components, etc., can solve the problem that the carrier cannot achieve the preset cooling effect and so on

Pending Publication Date: 2022-01-25
泉芯集成电路制造(济南)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of this application is to provide a cooling system and its control method to solve the problem in the prior art that the carrying platform cannot achieve the preset cooling effect

Method used

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  • Cooling system and control method thereof

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no. 1 example

[0042] As mentioned in the background technology, at present, a cooling machine is usually used to cool the chip during the ion implantation process. By connecting the water inlet and outlet of the cooling machine with the carrying platform, the effect of injecting deionized water into the carrying platform is realized. Furthermore, chip cooling is realized by means of heat transfer. However, due to problems such as hardware aging of the loading platform or the cooling machine, the coolant flowing through the channel of the loading platform cannot achieve the expected cooling effect, and thus the loading platform cannot reach the preset temperature.

[0043] In view of this, in order to solve the problem that the carrying platform cannot reach the preset temperature, the application provides a cooling system, which obtains the first temperature of the carrying platform and the second temperature of the water inlet of the cooler through the control device, and adjusts the coolin...

no. 2 example

[0070] Based on the first embodiment, the embodiment of the present application also provides a cooling system control method, please refer to Figure 4 , the method includes:

[0071] S102. Obtain the first temperature of the carrying platform and the second temperature of the water inlet of the cooling zone machine, and the carrying platform is used to place chips to be cooled.

[0072] S104. Adjust the amount of water delivered to the loading platform from the water outlet of the cooling machine according to the first temperature and the second temperature.

[0073] Among them, see Figure 5 , S104 includes:

[0074] S1041, determine whether the difference between the first temperature and the second temperature is greater than a first threshold, wherein the first threshold is greater than the second threshold, if yes, perform S1042, and if not, perform S1043.

[0075] S1042, reducing the water volume at the water outlet of the cooling machine, so as to reduce the water ...

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Abstract

The invention provides a cooling system and a control method thereof, and relates to the technical field of semiconductor chip preparation. The cooling system comprises a control device, a bearing table and a cooling machine communicated with a bearing table pipeline through a water inlet and a water outlet, a first temperature sensor is arranged on the bearing table to collect the first temperature of the bearing table, and a second temperature sensor is arranged at the water inlet of the cooling machine to collect the second temperature of the water inlet of the cooling machine. The bearing table is used for placing a to-be-cooled chip, and the first temperature sensor, the second temperature sensor and the cooling machine are electrically connected with the control device; and the control device is used for adjusting the water amount of the water outlet of the cooling machine according to the obtained first temperature and second temperature. According to the cooling system and the control method thereof, the effect of adjusting the heat dissipation capacity of the bearing table can be achieved.

Description

technical field [0001] The present application relates to the technical field of semiconductor chip preparation, in particular, to a cooling system and a control method thereof. Background technique [0002] During the chip ion implantation process, it is necessary to use low-temperature deionized water to remove excess heat in real time to prevent excessive ion diffusion and high temperature from causing chip stress effects. [0003] At present, a cooling machine is usually used to cool the chip during the ion implantation process. By connecting the water inlet and outlet of the cooling machine with the carrier platform, the effect of injecting deionized water into the carrier platform is realized, and then chip cooling is realized. [0004] However, during the cooling process of the chip, due to possible problems such as possible hardware aging of the carrier, the coolant flowing through the channel of the carrier cannot achieve the expected cooling effect, and thus the ca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01J37/317
CPCH01L21/67109H01L21/67248H01J37/3171
Inventor 廖宜专
Owner 泉芯集成电路制造(济南)有限公司
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