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Anti-scour flow equalizing assembly, falling film evaporator and air conditioning unit

A component and anti-shock technology, applied in evaporator/condenser, refrigeration components, refrigerators, etc., to solve the problem of inability to distribute refrigerant on heat exchange coils

Pending Publication Date: 2022-02-08
GREE ELECTRIC APPLIANCES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] One of the objectives of the present invention is to propose an anti-scouring flow equalization assembly and a falling film evaporator, which solves the technical problem that the liquid equalization orifice plate cannot accurately distribute the refrigerant on the heat exchange coil in the prior art

Method used

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  • Anti-scour flow equalizing assembly, falling film evaporator and air conditioning unit
  • Anti-scour flow equalizing assembly, falling film evaporator and air conditioning unit
  • Anti-scour flow equalizing assembly, falling film evaporator and air conditioning unit

Examples

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Embodiment 1

[0042] This embodiment describes in detail the anti-scouring current equalization component of the present invention.

[0043] The anti-scouring flow equalization assembly of this embodiment is used in a falling film evaporator. The anti-shock flow equalization assembly of this embodiment includes an anti-shock device 1, and the anti-shock device 1 is located below the inlet connecting pipe 3, such as figure 1 shown. Preferably, the anti-shock device 1 includes an anti-shock plate 11, a liquid separator plate 12, a top plate 13 and a side plate 14, and the anti-shock plate 11, the liquid separator plate 12 and the side plate 14 are enclosed to form an accommodating cavity, and the accommodating cavity and the inlet The connecting pipe 3 is connected, and the liquid separator plate 12 is an annular structure located in the middle of the anti-shock plate 11. There is a gap between the top of the liquid separator plate 12 and the top plate 13, such as figure 1 and figure 2 sh...

Embodiment 2

[0059] This embodiment describes the falling film evaporator of the present invention in detail.

[0060] The falling film evaporator of this embodiment includes the anti-scouring flow equalizing assembly of any one of the technical solutions in embodiment 1, and the anti-scouring flow equalizing assembly is arranged between the refrigerant inlet connecting pipe 3 and the heat exchange coil 4 . Such as figure 1 As shown, the falling film evaporator of this embodiment also includes an inlet connecting pipe 3, a heat exchange coil 4, a cylinder body 5 and an outlet connecting pipe 6, wherein the inlet connecting pipe 3 and the outlet connecting pipe 6 are located above the cylinder body 5; The flow component is located in the cylinder body 5 , and the anti-scour device 1 of the anti-scour flow equalization component is located below the inlet joint 3 , and the flow equalizer 2 of the anti-scour flow equalizer component is located above the heat exchange coil 4 .

[0061] figur...

Embodiment 3

[0064] This embodiment describes the air conditioning unit of the present invention in detail.

[0065] The air conditioning unit of this embodiment includes the falling film evaporator according to any one of the technical solutions in Embodiment 2. The rest of the structure of the air conditioning unit in this embodiment can be the same as that of the prior art, and will not be repeated here. Preferably, the air conditioner unit in this embodiment is a water-cooled unit.

[0066] The air-conditioning unit of this embodiment includes the falling-film evaporator of any one of the technical solutions in Embodiment 2. Since the heat exchange efficiency and service life of the falling-film evaporator are improved, the performance of the air-conditioning unit of this embodiment is improved. Increased lifespan.

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Abstract

The invention discloses an anti-scour flow equalizing assembly, a falling film evaporator and an air conditioning unit, relates to the technical field of air conditioners, and solves the technical problem that a liquid equalizing pore plate cannot accurately distribute a refrigerant on a heat exchange coil in the prior art. The anti-scour flow equalizing assembly comprises an anti-scour device, the anti-scour device is located below an inlet connecting pipe, the anti-scour device comprises an anti-scour plate, a liquid distribution plate, a top plate and a side plate, the anti-scour plate, the liquid distribution plate and the side plate define a containing cavity, the containing cavity communicates with the inlet connecting pipe, the liquid distribution plate is of an annular structure located in the middle of the anti-scour plate, and a gap is formed between the top of the liquid distribution plate and the top plate. According to the anti-scour flow equalizing assembly, the gap is formed between the top of the liquid distribution plate and the top plate, so that a gaseous refrigerant moving to the anti-scour plate can escape from the gap, and the problems that spraying flow deviates due to flowing of refrigerant steam when the liquid refrigerant flows downwards through the liquid distribution plate, and consequently the wall drying phenomenon occurs on the surface of a heat exchange coil are solved.

Description

technical field [0001] The invention relates to the technical field of air conditioning, in particular to an anti-scouring flow equalization assembly, a falling film evaporator including the anti-scouring flow equalization assembly, and an air conditioner unit including the falling film evaporator. Background technique [0002] In the environment of energy saving, emission reduction, cost reduction and efficiency improvement, water-cooled units show a trend of diversification and rapid development, while falling film evaporators have gradually become the focus of major enterprises due to their low refrigerant charge and high heat transfer efficiency. focus. Compared with the traditional flooded evaporator, the falling film evaporator can reduce the refrigerant charge by about 25%. At the same time, due to its high heat exchange efficiency, it can maintain the same heat exchange performance of the unit. Reduce the number of heat exchange tubes and reduce the size of the unit...

Claims

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Application Information

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IPC IPC(8): F25B39/02F28F9/22
CPCF25B39/028F28F9/22F25B2339/02F28F2009/222
Inventor 郑威胡海利卢杏斌王小勇
Owner GREE ELECTRIC APPLIANCES INC
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