PCB substrate and production method thereof

Abstract

The invention discloses a PCB substrate and a production method thereof. The PCB substrate comprises an inner-layer core plate, an outer-wrapping copper plate and a protective coating; and prepregs are mounted on the front and back surfaces of the inner-layer core plate. The production method of the PCB substrate comprises the following steps of: step 1, substrate comprehensive treatment; step 2, PTH and primary copper plating; step 3, circuit wet film preparation; step 4, secondary copper plating, tin and lead plating and etching; step 5, solder mask wet film preparation; step 6, character printing; step 7, surface treatment; step 8, forming; and step 9, detection and packaging. The prepregs are installed on the front face and the back face of the inner-layer core plate; electric elements on the top of the inner-layer core plate can be protected through the prepregs; the prepregs are made of a soft material and have good flexibility; flexible pressure reduction can be conducted on the electric elements on the top of the inner-layer core plate when the device is under pressure, and therefore, the safety of the electric elements is ensured, the electric elements are prevented from being damaged by pressure, and the service lives of the electric elements are prolonged.

Description

technical field [0001] The invention relates to the technical field of PCB substrates, in particular to PCB substrates and a production method thereof. Background technique [0002] PCB substrate, also known as circuit board printing, is a very developed new industry today, and the rapid development of screen printing has injected vitality into this industry and brought major changes to the electronics industry. The current screen printing process can fully adapt to high density of PCB production. [0003] However, the existing PCB substrates have poor oxidation resistance. During the long-term use of the PCB substrates, they are easily damaged by oxidation, thereby shortening the service life of the PCB substrates, and also increasing the maintenance rate of the PCB substrates during use, thereby improving The maintenance cost of the PCB substrate is reduced, and the practicability of the PCB substrate is reduced, so it needs to be improved. For this reason, we propose a P...

AI Technical Summary

Problems solved by technology

[0003] However, the existing PCB substrates have poor oxidation resistance. During the long-term use of the PCB substrates, they are easily damaged by oxidation, thereby shortening the service life of the PCB substrates, and also increasing the maintenance rate of the PCB substrates during use, thereby improving It reduces the maintenance cost of the PCB substrate and reduces the practicability of the PCB substrate, so it needs to be improved. For this reason, we propose a PCB substrate and its production method to solve the above problems

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