A flattening treatment device for copper foil production

Abstract

The invention relates to the technical field of copper foil production, in particular to a flattening treatment device for copper foil production, comprising a worktable, a support plate, a rolling unit and a winding unit. The upper end of the worktable is symmetrically arranged with two supporting The support plate, the opposite side of the support plate is provided with a rolling unit and a winding unit in sequence from left to right; the existing flattening device has the following problems: when the existing device is flattening copper foils of different thicknesses, The device needs to be adjusted accordingly, and the operation is complicated; the device cannot perform all-round flattening treatment on the copper foil, and there is a flattening dead angle, so that the flattening effect of the copper foil cannot be guaranteed; The flattening treatment does not require frequent adjustment of the device, thereby saving the workload; the present invention can flatten the copper foil in all directions by flattening the elastic sheet, so the flatness of the copper foil can be ensured, thereby ensuring that the copper foil is flattened. Flattening effect of foil.

Description

technical field [0001] The invention relates to the technical field of copper foil production, in particular to a flattening treatment device for copper foil production. Background technique [0002] Copper foil is a cathodic electrolytic material, a thin, continuous metal foil deposited on the substrate layer of the circuit board. Copper foil has low surface oxygen characteristics and can be attached to various substrates, such as metal, Insulation materials, etc. In the production process of copper foil, in order to ensure the flatness of the copper foil, the copper foil needs to be flattened to improve the use effect of the copper foil in the later stage. [0003] The Chinese utility model patent with publication number CN210497743U discloses a flattening device for copper foil, which can flatten copper foils of different thicknesses through a feeding roller and a moving roller device, and is prepared for flattening in advance, Bring convenience for subsequent flattening...

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Problems solved by technology

[0004] The flattening device used in the above-mentioned patent still has the following problems: 1. When the above-mentioned device is flattening copper foils of different thicknesses, the device needs to be adjusted accordingly, the operation is cumbersome, and the device cannot ensure the tension of the copper foil , so the copper foil is prone to wrinkles during the transmission process, which affects the flattening effect of the copper foil, thereby increasing the defective rate

[0005] 2. The above-mentioned device can only flatten the copper foil once, and cannot flatten the copper foil in all directions. There is a flattening dead angle, and the copper foil cannot be guided, so the copper foil is prone to tilt during transmission, and then The edge of the copper foil is easy to interfere with the device, which is easy to cause the edge of the copper foil to crack

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