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Flexible circuit board assembly, manufacturing method thereof and display device

A technology of flexible circuit boards and manufacturing methods, applied to printed circuit parts, circuits, printed circuits, etc., can solve the problems of MFPC without layout area and increased power consumption of OLED display modules, so as to reduce the risk of burnout and reduce line Wide, the effect that meets the layout requirements

Pending Publication Date: 2022-02-25
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the continuous development of display technology, the resolution required by the terminal is getting higher and higher, and the power consumption of the OLED display module is increasing. In order to reduce the wiring resistance, the wiring width of the MFPC needs to be increased, but the MFPC does not have enough layout area.

Method used

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  • Flexible circuit board assembly, manufacturing method thereof and display device
  • Flexible circuit board assembly, manufacturing method thereof and display device
  • Flexible circuit board assembly, manufacturing method thereof and display device

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Embodiment Construction

[0040] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0041] Such as figure 1 As shown, 1 is the power line. With the increase of the resolution of the display module, the driving current of the display module increases. In order to meet the resistance requirements of the power line 1, the line width of the power line 1 is larger, resulting in MFPC Dimensions are expanded. Additionally, if figure 2 As shown, when the MFPC is bound to the display module, due to insufficient space in the binding area, part of the width of the power line 1 needs to be sacrificed, resulting in a potential risk of burning the MFPC.

[0042] Embodiments of the present invention provide a flexible circuit board assembly, a manufacturing method thereof, and a display device, which can reduce the line width of ...

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Abstract

The invention provides a flexible circuit board assembly, a manufacturing method thereof and a display device, and belongs to the technical field of display. The flexible circuit board assembly comprises a substrate and a first wire; the substrate comprises a hollow part, and a conductive pattern is arranged in the hollow part; the first wire is located on the first surface of the substrate, the orthographic projection of the first wire on the substrate and the hollow part have an overlapped part, and the first wire is in contact with the conductive pattern. According to the flexible circuit board assembly provided by the technical schemes, the wiring width of the flexible circuit board assembly can be reduced.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a flexible circuit board assembly, a manufacturing method thereof, and a display device. Background technique [0002] OLED (Organic Light-Emitting Diode, organic light-emitting diode, referred to as OLED) display device has thin, light, wide viewing angle, active light emission, continuously adjustable light color, low cost, fast response speed, low energy consumption, low driving voltage, With the advantages of wide operating temperature range, simple production process, high luminous efficiency and flexible display, it has been listed as a promising next-generation display technology. [0003] The drive integrated circuit chip (Drive IC) and the main flexible circuit board (MFPC) are used for circuit driving of the OLED display module, and are generally bound and connected with the OLED display module. With the continuous development of display technology, the resolution req...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/11G09G3/3208H01L27/32
CPCH05K1/028H05K1/116H05K1/118G09G3/3208H10K59/10
Inventor 方远刘晓霞王畅张家祥王春燕白久园左堃王明强穆鑫胡宏锦陈泳霖
Owner BOE TECH GRP CO LTD
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