This invention relates to the field of
resistor technology, specifically to a
high power density power
resistor with a wide resistance range. It includes a housing and multiple
resistor units stacked within the housing. Each resistor unit includes an insulating support substrate and a resistor sheet encased within the support substrate. The resistor sheet has conductive portions bent at both ends, extending to the outer surface of the support substrate. Adjacent resistor units are connected via these conductive portions. An air duct is provided between the support substrates of adjacent resistor units. The
high power density allows the resistor unit spacing to be adjusted within any range based on the thickness of the support substrate, enabling
forced air cooling heat exchange and minimizing the volume to the theoretical minimum. It also offers higher protection levels and
corrosion resistance, achieving high levels of
waterproofing and dustproofing; and meets the high requirements for large creepage distances and clearances even under
high voltage conditions.