Resin composition, prepreg containing same, laminated board and printed circuit board

A resin composition, printed circuit board technology, applied in the field of laminates and printed circuit boards, resin composition, can solve the problem of general interlayer adhesion, achieve no resin enrichment problem, excellent interlayer The effect of adhesion

Active Publication Date: 2022-03-11
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, many current resin compositions cannot avoid resin problems when used in printed circuit boards, and the interlayer adhesion performance is mediocre.

Method used

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  • Resin composition, prepreg containing same, laminated board and printed circuit board
  • Resin composition, prepreg containing same, laminated board and printed circuit board
  • Resin composition, prepreg containing same, laminated board and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] This embodiment provides an epoxy resin copper-clad laminate, which is prepared from a resin composition, and the resin composition includes: (A) a DCPD epoxy resin with a softening point of less than 95°C, (B ) active ester resin, (C) phosphorus-containing phenolic resin and (D) inorganic filler.

[0058] The preparation method of above-mentioned laminated board comprises the steps:

[0059] Get a container, add 100 parts by weight of epoxy resin KES-7680M75, 22.3 parts by weight of active ester resin HPC-8000-65T, 22.3 parts by weight of active ester resin HPC-8000L-65MT, 54.2 parts by weight of phosphorus-containing phenolic resin JFH-Z3101P60, 30wt% (85.2 parts by weight, accounting for 30wt% of the total of epoxy resin, active ester resin, phosphorus-containing phenolic resin and inorganic filler) inorganic filler DS2032A, pre-dissolved curing accelerator DMAP, continue to stir evenly, Finally, a solvent is used to adjust the solid content of the liquid to 65%, th...

Embodiment 2-11

[0062] The manufacturing process of Example 2-11 is the same as that of Example 1, and the formula composition and its physical properties are shown in Table 1-2.

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Abstract

The invention relates to a resin composition, a prepreg containing the same, a laminated board and a printed circuit board. The resin composition comprises (A) DCPD epoxy resin, (B) active ester resin, (C) phosphorus-containing phenolic resin and (D) inorganic filler, the DCPD epoxy resin at least contains one kind of DCPD epoxy resin with the softening point smaller than 95 DEG C, and the mass percent of the DCPD epoxy resin with the softening point smaller than 95 DEG C in the DCPD epoxy resin is 40% or above. The prepreg, the laminated board and the printed circuit board prepared from the resin composition are free of the problem of resin enrichment and have excellent interlayer bonding force.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a resin composition, a prepreg containing the resin composition, a laminated board and a printed circuit board. Background technique [0002] Laminates are the substrate materials of printed circuit boards. As printed circuit boards or laminates are used more and more widely and their applications become more and more high-end, the performance requirements for printed circuit boards or laminates are also increasing. The key resin composition that acts as an insulating medium in laminates is increasingly comprised of ingredients. In order to improve the coefficient of thermal expansion, improve electrical properties, rigidity and other properties, fillers become an essential component, and multi-phase and multi-component often bring the problem of multi-phase compatibility. Resin enrichment means that among the organic and inorganic fillers that should be distribut...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L67/02C08K3/36C08K7/14C08J5/24B32B15/20B32B15/04B32B17/04B32B17/06
CPCC08L63/00C08J5/24B32B15/20B32B15/14B32B5/02B32B5/26C08J2363/00C08J2463/00C08J2467/02B32B2260/023B32B2260/046B32B2262/101B32B2457/08C08L2205/025C08L67/02C08K3/36C08K7/14
Inventor 何烈相吴彦兵
Owner GUANGDONG SHENGYI SCI TECH
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